In today's rapidly changing semiconductor technology, high-speed interconnects between chips have become a key factor driving system performance. Recently, Eliyan set a new milestone in semiconductor interconnect technology with its NuLink-2.0™ chip-interconnect PHY. Fabricated on an advanced 3nm process, the chip not only achieves an unprecedented 64Gbps/bump data transfer rate, but also provides a superior performance and low-power solution for multi-chip architectures.
Technological innovation and performance leaps
The advent of NuLink-2.0™ PHY is a major breakthrough for Eliyan in the field of chip interconnect technology. The chip has achieved a qualitative leap in data transfer rate, and its 64Gbps/bump rate far exceeds the current industry average. This performance improvement is due to Eliyan's in-depth optimization and innovation in PHY design. Through comprehensive improvements in signal integrity, power management, and packaging technology, the NuLink-2.0™ PHY achieves lower power consumption and a smaller footprint while maintaining high performance.
In a standard package, the NuLink-2.0™ PHY is capable of delivering up to 5 Tbps/mm bandwidth, while with advanced packaging technology, this number soars to 21 Tbps/mm. This means that the NuLink-2.0™ PHY is able to transfer more data in the same package size, which significantly improves system performance.
Figure: Eliyan unveils its NuLink-2.0™ chip-interconnect PHY on a 3nm process
Compatibility and flexibility
It is worth mentioning that the NuLink-2.0™ PHY also has excellent compatibility. The chip is compatible with the Universal Chip Module Interconnect (UCIe) standard, which allows it to be easily integrated into a wide range of multi-chip systems. By being compatible with the UCIe standard, NuLink-2.0™ PHY not only improves system interoperability, but also provides greater flexibility and cost-effectiveness in chip design.
Low power consumption and high performance
In terms of power consumption, the NuLink-2.0™ PHY also excels. With the rapid growth of markets such as AI, high-performance computing (HPC), and edge applications, the need for high performance and low power consumption is becoming more urgent. Eliyan's NuLink-2.0™ PHY meets this need, and its low power consumption makes it ideal for future AI systems to customize HBM4 base chips. By optimizing power management, the NuLink-2.0™ PHY achieves lower power consumption while maintaining high performance, resulting in longer battery life and improved overall energy efficiency.
Market application and prospects
The introduction of NuLink-2.0™ PHY not only reduces the cost of chip-based designs, but also brings new development opportunities to multiple market segments. In the inference and gaming domains, the high-speed interconnection capabilities of the NuLink-2.0™ PHY provide a more efficient and reliable computing platform for these applications. In addition, the flexibility of its technology allows it to adapt to demanding markets such as aerospace and automotive. In these areas, the requirements for system performance, reliability, and power consumption are extremely high, and the NuLink-2.0™ PHY meets these needs.
Looking to the future, with the continuous development of 5G, Internet of Things, autonomous driving and other technologies, the demand for high-speed and low-latency chip interconnection will grow day by day. Eliyan's NuLink-2.0™ PHY is expected to occupy an important position in the future semiconductor market due to its excellent performance, compatibility, and low power consumption. Through continuous innovation and optimization, Eliyan will continue to push the development of chip interconnect technology in the direction of higher speed and lower power consumption, bringing new opportunities and challenges to future high-performance computing, AI applications and demanding markets.
Epilogue
In summary, the launch of Eliyan's NuLink-2.0™ chip-interconnect PHY is not only a major breakthrough in the company's technology, but also a significant sign of the progress of interconnection technology in the entire semiconductor industry. With the adoption of the 3nm process and the high-performance realization of 64Gbps/bump, Eliyan is leading a new wave of change in chip interconnect technology. We have reason to believe that in the future semiconductor market, Eliyan will continue to maintain its leading position and bring more innovations and breakthroughs to the industry.
