December 22, 2022 APEC mid and small size Enterprises Business Forum, the Ministry of Industry and Information Technology Equipment Industry Division I first-class inspector Miao Changxing said that in the past two years, the overall development of the automotive industry has been affected by the sudden outbreak of COVID-19 epidemic, the supply of automotive chip shortages and other unfavorable factors, but the development trend of automotive electrification, intelligentization and networking is unstoppable. From January to November this year, China's automobile production and sales were 24.628 million and 24.302 million respectively, up 6.1% and 3.3% year-on-year. New energy automobile production and sales reached 6.253 million and 6.057 million respectively, more than doubling year-on-year. The number of intelligent networked passenger cars reached 8 million, and the market penetration rate increased to 33.6%.
China's vigorous automobile manufacturing and sales makes increase the demand for automobile chips. Xu Yanhua, deputy secretary-general of China Automotive Chip Industry Innovation Alliance, told the media that from the market prospect, the price of bicycle chips is 500-600 US dollars, and the scale of China's automotive chip market has reached 15 billion US dollars, exceeding the output value of 100 billion yuan. With the further improvement of the penetration rate of electric vehicle market, the output value of chips is estimated to reach 20 billion US dollars in 2025, which is converted into RMB 140-150 billion, and the market prospect is promising.
In the era of software-defined cars, driven by the upgrading of electronic consumption demand and the enabling of ICT technology, cars are no longer just a kind of machinery travel tools are evolving into an intelligent evolution body. The recent technical situation of new cars in perception, decision-making and execution ability will drive the research and development and application of car gauge chips from customization, high reliability and high safety to standard serialization, centralization, high performance, high reliability and high safety. What new development trends will appear in the car gauge chip? This article is interpreted in detail.
Trend 1: Low power consumption and low costs control chips will become the mainstream of standardized chips in vehicle control domain
Han Sanchu, chief expert of CHONGQING CHANGAN Automobile Co., Ltd., said that the intelligentization and electrification of the new auto time need a computing platform supported by heterogeneous general-purpose chips with high performance computing and process chips with higher reliability, so there is a new trend and new opportunities for automotive grade chips.
Automotive grade chip
He believes that the electronic and electrical architecture of automobiles has evolved from distributed to domain controller architecture, and is gradually evolving into central centralized architecture, and the number and structural layout of chips have also changed. In order to meet the personalized and differentiated automobile product strategy and realize the goal of serialized and industrialized intelligent automobile platform, the low-power and low-cost control chips serialized in vehicle control domain standards will gradually become the mainstream of the industry.
Automotive applications are MCU the largest application market downstream of the chip. SEMIDRIVE vice president Chen Shujie, said that cars are developing in the direction of multi-domain integration. If cars want to become autobots, they must be as intelligent as transformers autopilot function, but also have intelligent cockpit function, but also need perception ability, this is the central gateway chip, and also needs important high-reliability and high-security control chips. SEMIDRIVE is laid out around the whole scene chip of the automobile IC design company.
Latest the news shows that SEMIDRIVE E3 series products won the Domestic Innovative Automotive Chip Award, which is based onARMCortex-R5F, functional safety level up to ASIL D, passed AEC-Q100 Grade 1 reliability test, CPU with a main frequency of up to 800MHz and up to 6 CPU cores, it is the product with the highest performance among the existing mass production MCU, filling the gap in the domestic market of high-end and high-safety MCU. This product was mass-produced in October this year, and now more than 100 customers use E3 for product design.
Trend 2: Smart cockpit chips tend to be integrated chips with high computing power, emphasizing multi-scene integration capabilities
The latest Li Auto L9 cancels the traditional instrument screen and replaces it with HUD + Safe Driving Interactive Screen. This SUV model has created a new era of "five screens and three-dimensional space interaction". There are 6 microphones and 3DToF in the car sensor, with the ideal car self-developed to deep learning based on the multi-modal three-dimensional space interaction technology, human beings will interact in the most natural way in the car. This car uses two QUALCOMM Snapdragon 8155 chip, 24GB Memory + 256G High Speed Storage, Dual5GOperators switch to provide computing power and network support.
Trends of smart cockpit chips
MEDIA TEK Xiong Jian, director of the Business Department, believes that intelligent cockpit chips need three capabilities to build. First of all, it needs high computing power supported by advanced processes. The ability to support multiple scenarios requires the chip to have very powerful parallel processing capability, and the chip has high computing power, CPU, GPUNPU should have higher and higher computing power and control its cost. Second, multi-scene capability, integrated support for high-definition display, high-quality sound effects, and multi-screen collaboration; Third, the system security capability, how to protect users' personal privacy, including important data security, digital RMB for future payment, etc., and how to protect payment security.
As the world's first mass-produced 7nm process car chip, QUALCOMM 8155 was once considered as the most powerful cockpit SoC chip available for mass-produced cars. In 2021, QUALSOMM launched the fourth generations intelligent cockpit chip 8295, using a 5 nm process technology for AI the NPU computing power of learning reaches 30TOPS, which is nearly 8 times that of 8155. This year, MEDIATEK MT8675 adopts 7nm process, which has been successfully mass-produced and can provide 7nm + 5G T-BOX cockpit solution within 2000 yuan.
Trend 3: The trend of cabin integration is accelerating, and the big computing power chip is accelerating
Han Sanchu, chief expert of CHANGAN automobile Co., Ltd., said that multi-mode interaction and central computing drive automobile computing chips to have deep learning artificial intelligence with the development of chips, the chip structure has evolved to the supercomputing brain, forming a central computing unit integrating cabin and driving, and accelerating the improvement of the intelligent level of the whole vehicle. With the continuous improvement of user scene experience of point-to-point pilot driving vehicle service, cabin control integration, central computing and other technologies, the application of automotive grade chips with higher performance and computing power in the new automobile field will be promoted.
According to public data, L3 level is a watershed in computing power demand. The required AI computing power is roughly 100TOPS, the computing power required by L4 will reach 500TOPS, and the computing power requirements of L5 are more stringent, which is expected to exceed 1000TOPS. Of course, it depends on all parties. Algorithm degree of optimization of.
Huang Chang, co-founder and CTO of HORIZON, told reporters that autonomous driving is moving towards mass production, and the demand for computing power continues to increase. At present, the mainstream car factory is the evolution route of L2 + to L4 automatic driving. The evolution of AI algorithm has greatly promoted the development of automobile intelligence. The application scenarios covered by automatic driving have gone from the earliest collision avoidance and lane keeping to the current lane change and overtaking, and even completed more complex functions under various complex conditions. These new functions have an increasing demand for data processing and computing power of computing platforms. The new trend is that AI computing gradually replaces logic computing and becomes the core of vehicle computing, especially towards higher-level automatic driving above L3.
In the field of automotive grade large computing power chips, in the old-fashioned exclusive market situation such as NVIDIA and QUALCOMM has been gradually broken, and brands represented by HUAWEI, HORIZON and BLACK SESAME have joined the war. In 2022 or 2023, it will be the mass production year of Chinese-made large computing power chips.
Trend 4: New energy vehicles are superimposed with automatic driving requirements, and on-board memory chips LPDDR5X and UFS3.1 are accelerated on board
Robert Bielby, senior director of automotive system architecture of MICRON, told electronic enthusiasts that with the continuous development of self-driving cars, higher-level advanced driving assistance systems (ADAS) is driving the growth of storage demand in the automotive field, and the first applications include products such AS black boxes (vehicle traveling recorders) that record events before accidents. These applications are continuously driving the growth of communication data in automobiles. To support black boxes and similar applications, the storage density of high-end cars in the future may reach 1 TB to 4 TB. Part of the demand for automobile storage comes from intelligent cockpit. Intelligent cockpit has the main infotainment unit, dashboard and connectivity, and is currently the main storage user.
In 2022, MICRON launched the industry's first ASIL D rating that only passed the ISO 26262 standardCertificationLPDDR5X of. ISO 26262 is a functional safety standard for the automotive industry, which can reflect the key capabilities of deploying ADAS and in-vehicle infotainment system (IVI).
From the application field, Micron's UFS product portfolio is widely used in ADAS and on-board infotainment system. Because the overall performance of UFS is higher than that of the previous generation eMMC, UFS 3.1 product series can provide critical "instant start" performance to meet consumers' expectations for in-vehicle infotainment systems and ADAS applications. Moreover, consumers expect cars to be an extension of the digital lifestyle.
In this field, LONGSYS, a major domestic storage company, is also following up quickly. At ELEXCON International Electronics Show, LONGSYS displayed FORESEE's first automotive grade UFS product. From the measured data inside LONGSYS, it can be intuitively seen that in terms of data transmission, the write performance of FORESEE automotive grade UFS 2.1 is 1.5 times higher than that of eMMC, and the read performance is 2.5 times higher. Looking at UFS 3.1, the reading performance is improved by more than 6 times compared with eMMC, and the reading and writing performance is as high as 4 times.
Trend 5: Vehicle power Semiconductor The market breaks the international monopoly, and domestic manufacturers are rapidly rising
Automotive grade IGBT It is the core component of new energy vehicle motor controller, vehicle air conditioner, charging pile and other equipment. According to INFINEON, the annual report shows that the value of power semiconductor devices in new energy vehicles is about five times that of traditional fuel vehicles.
Wen Junpei, head of the body and intelligent network connection business unit of INFINEON Automotive Electronics Division, said that traditional automobile manufacturers are accelerating the transformation to new energy vehicles. One of the inverters in every two new energy vehicles is a power semiconductor installed in INFINEON. In IGBT and silicon carbide markets. According to the data of overseas research institutions, INFINEON ranks second in the market share of automotive silicon carbide. In 2021, INFINEON 8-inch and 12-inch fabs in Austria will all be put into production, and 25 million vehicles can be supplied in the future.
China has become the largest IGBT market in the world, and domestic suppliers such as BYD Semiconductor, STARPOWER, CRRC Times and SILAN Microelectronics have risen in China, which have replaced some products of foreign manufacturers to a certain extent. There are two main types of power semiconductors manufactured by car factories. One is similar to BYD Semiconductor, which relies on its own vehicle platform for production. At present, BYD Semiconductor has achieved a cumulative loading capacity of IGBT modules of over one million vehicles. Other is SAIC INFINEON automotive, which has already produced IGBT in large quantities.
2022 APEC mid and small size Enterprises Business Forum
BYD recently introduced the super hybrid DM4.0 IGBT module, which adopts self-developed high-performance IGBT and ultra-fast soft recovery diode chip technology with extremely low loss and excellent over-current capability, it is at the leading level in the industry. Its integrated module has inverter and boost parts at the same time, which is matched with the drive module in a complete set, with high integration and space saving. It is reported that this series of modules have been loaded in batches since 2021 and have been fully applied to BYD DMI models.
Lian Yubo, executive vice president of BYD Group, said that BYD has fully mastered batteries, motor, electronic control and automotive grade chips, etc., have become an enterprise providing overall solutions for new energy. BYD has built the capability of R&D and manufacturing of the whole industrial chain of the whole vehicle, covering parts, key systems, and then technological innovation at all levels of the whole vehicle. The products cover three fields: passenger cars, commercial vehicles and special vehicles. The author believes that BYD internationalization strategy has been fully launched this year, not only entering Southeast Asia and Japan markets, but also entering the European market, and has the capital to compete with international automobile giants on the same stage.
The penetration rate of intelligent networked automobile market increases, and there is a new development trend of vehicle regulation chip-China exportsemi.com
