Power semiconductors are the core components in industrial control and automation. Devices like IGBT find widespread application in AC motors, inverter welders, frequency converters, servo drives, UPS (Uninterruptible Power Supplies), etc., enabling precision control, improving efficiency, and reliability of energy power conversion, ultimately contributing to energy conservation goals. With the popularization of concepts such as the fourth Industrial Revolution and Intelligent Manufacturing, the demand for power semiconductors in industrial control continues to increase.
At the same time, power semiconductor is also the core of power conversion and circuit control in electronic devices, which is mainly used to change voltage and frequency, DC-AC conversion and so on. In recent years, with the rapid development of the national economy, the application fields of power semiconductors have expanded from industrial control and consumer electronics to many markets such as new energy, rail transit, smart grid, variable frequency home appliances, 5G, etc., and the market scale has shown a steady growth trend.
In the field of communication, especially in the field of 5G communication, the demand is keep rising. Compared with 4G, the speed of 5G is greatly improved, which brings about a large increase in power and power consumption. At the base station, 5G employs massive antenna arrays, demanding higher performance from power devices. Simultaneously, there is an increase in the power supply requirements for base stations, leading to an upsurge in the usage of high-voltage power devices. On the receiving end, applications like 5G millimeter waves result in increased power density, escalating the need for upgraded power devices. Downstream in data centers, there is a demand for expansion and reduced consumption, with UPS systems advancing towards high power and low loss. This increases the overall requirement for power devices in UPS systems, driving an upgrade towards superior performance. The power device market in data centers is poised for rapid growth
Benefiting from the rapid development of new energy vehicles and 5G industry, the demand for high-performance power devices in charging piles, 5G communication base stations and vehicle regulation levels will continue to increase, and the market share and importance of high-performance products represented by high-voltage super junction MOSFET in the field of power devices will continue to increase.
Figure1: CHIPPACKING Technology Co., Ltd
Recently, CHIPPACKING Technology announced that the company will issue shares through a simplified process to specific targets, raising a total amount of no more than 130 million yuan. The funds raised will be used for the construction of the third-generation semiconductor and advanced packaging project for silicon power devices, as well as for repaying bank loans. CHIPPACKING Technology said that the company has been committed to R&D and innovation of semiconductor packaging and testing related technologies, continuously strengthened R&D investment, and mastered a number of core technologies. CHIPPACKING will follow the future development trend to reinforce investment in emerging fields and continue to invest research and develop of power semiconductor and advanced packaging, and develop more categories of power semiconductor packaging and advanced packaging technologies to provide strong technical support for company.
It is reported that CHIPPACKING Technology was establish in Shenzhen, the pioneer of China's reform and opening up in 2006. Based on the research and development and application of integrated circuit packaging and testing technology, it is a national high-tech enterprise engaged in integrated circuit packaging and testing and providing packaging technology solutions. The company pays attention to the research and development and upgrading of integrated circuit packaging and testing technology, and builds a market competitive advantage through iterative product update. The company has mastered many core technologies such as 5G MIMO base station GaN microwave RF power amplifier plastic packaging technology, high-density large matrix integrated circuit packaging technology, miniaturized packaging scheme with independent pin design, etc., forming its own competitive advantage in the field of integrated circuit packaging and having strong competitive strength in the field of integrated circuit packaging and testing.
After years of accumulation and development, CHIPPACKING Technology has grown into one of the largest domestic integrated circuit packaging and testing enterprises in the South China region. It stands out among domestic IC packaging and testing service providers for its robust quality management system and innovative technological capabilities, making it a leading applied technology enterprise
The issuance of shares by CHIPPACKING Technology is conducive to seizing market opportunities, expanding the industrial layout of the company in the packaging and testing industry, and improving the profitability of listed companies while meeting the rapid growth of market demand. Through this issuance, the Company will further enhance its financial strength, increase the scale of total assets and net assets, optimize its capital structure, enhance its solvency, reduce financial risks, enhance its stable operation ability, enhance the competitive strength of listed companies and achieve sustainable development.
Style Technology plans to build the third generations advanced packaging and testing project of semiconductors and silicon power devices-China.exportsemi.com
