With the rapid development and wide application of artificial intelligence technology, the demand for AI chips has skyrocketed. In order to meet the market's urgent need for high-performance AI chips, Resonac recently announced its production expansion plans, according to Japanese media news reports. This company, as an important player in the semiconductor industry, announced plans to expand its production capacity of materials for high-performance semiconductors, such as AI semiconductors, by 3.5 to 5 times to meet the market's strong demand. This decision was made after an in-depth analysis of current market trends and future forecasts, with the aim of strengthening the company's market competitiveness and ensuring that it is able to continue to provide advanced AI solutions to support its customers' business growth. Resonac's production expansion plan covers a number of aspects, including but not limited to increasing production lines, upgrading manufacturing technologies, expanding its R&D team, and optimizing supply chain management. In addition, Resonac plans to increase its investment in R&D to drive innovation in AI chip technology. This includes improvements to existing products and the development of new generation products aimed at providing customers with more efficient, energy-saving and smarter AI chips. The company's R&D team will work to explore new materials, designs and manufacturing processes to ensure Resonac's technological leadership in AI chips.
This expansion program is focused on two products: Non-Conductive Film (NFC) and Thermal Interface Material (TIM). These two products have been widely adopted by Resonac's customers and are successfully used in high-performance semiconductors, with NFC being used in "HBM" memories mounted on high-performance semiconductors and TIM being used for heat dissipation in high-performance semiconductors. Resonac pointed out that this expansion plan investment of about 15 billion yen, and plans to start production from 2024 onwards. This demonstrates Resonac's long-term optimism in the AI semiconductor market and its desire to further consolidate its market advantage by expanding production capacity.
In addition, Resonac forecasts that by 2027, the AI semiconductor market will expand to 2.7 times its 2022 size. This forecast further proves the huge potential and broad prospects of the AI chip market. As the market size continues to expand, the demand for high-performance semiconductors will also continue to grow, thus presenting tremendous growth opportunities for semiconductor companies such as Resonac. Overall, the surge in demand for AI chips brings a rare development opportunity for semiconductor companies such as Resonac. Through measures such as expanding production capacity, optimizing product mix, and improving production efficiency, these companies are expected to stand out in the fierce market competition and achieve sustained and steady development. At the same time, this will also promote the progress and innovation of the entire semiconductor industry, providing strong support for the wider application of AI technology.
