Chiplet: The New Frontier of Semiconductor Competition

With the rapid development of the semiconductor industry, the traditional chip manufacturing technology is facing the challenge of the physical limit of Moore's Law. In this context, Chiplet technology has emerged as a new engine to drive the industry. Chiplet technology has revolutionized the semiconductor industry by breaking down complex chip systems into smaller, more flexible modular units, which not only improves design efficiency but also reduces costs.

The advantage of die technology lies in its modular design concept, which allows chip units (dies) with different functions to be manufactured independently and then integrated together through advanced packaging technology. This approach offers several significant advantages:

Chiplet can be manufactured in the most suitable process according to functional requirements, reducing the dependence on the most advanced processes and thus lowering the overall R&D and manufacturing costs.

Core grain technology makes chip design more flexible, allowing for rapid iteration and updating of products according to market demand, greatly shortening the product launch cycle.

Through heterogeneous integration, core technology can break through the performance limitations of a single chip and realize the continuous improvement of arithmetic power.

The promotion of core particle technology requires collaboration and standardization within the industry, which promotes the formation of technology alliances and the establishment of international and domestic standards.

Globally, a number of semiconductor companies have begun to lay out core grain technology. international major manufacturers such as AMD and Nvidia have adopted core grain solutions in their products, while domestic emerging companies such as Polar Bear Tech and Xinli Intelligent technology are also actively developing related technologies and products. According to research organizations, the market size of Chiplet is expected to reach US$5.8 billion by 2024, and will further expand to more than US$57 billion by 2035, showing great market potential.

In China, Chiplet technology is regarded as an important way to solve the arithmetic problem, especially in the current context of intensifying global semiconductor competition, Chiplet technology provides a breakthrough opportunity for China's semiconductor industry. The Chinese Association for Science and Technology (CAST) has listed Chiplet technology and industrial breakthroughs as one of the major scientific issues, showing the importance attached at the national level. Meanwhile, the rapid development of domestic enterprises in the field of Chiplet also signals that China is expected to realize technological breakthroughs and industrial upgrading in this emerging field.

As a new competitive field of semiconductor manufacturing, core particle technology is leading the industry's future development direction. It not only helps to improve chip performance and reduce costs, but also promotes the development of industrial ecology and technological innovation. As the technology continues to mature and the market scale expands, core particle technology is expected to become a key force driving the development of the global semiconductor industry.