In the midst of the rapid development of IoT and smart home technologies, Infineon Technologies AG, a global semiconductor leader in power systems and IoT, has recently announced the launch of a XENSIV™ Sensor Expansion Board designed specifically for Arduino. The launch of this innovative tool marks an important step for Infineon in the evaluation and development of smart sensor systems.
This XENSIV™ Sensor Expansion Board is a multi-functional development platform designed as a versatile tool for evaluating smart sensor systems in smart homes and various consumer applications. It integrates Infineon's advanced sensor technology with Sensirion's SHT35 humidity and temperature sensors. With this integration, Infineon not only simplifies the functionality of the product, but also significantly improves the design process for customers. The expansion board utilizes Infineon's microcontrollers, wireless connectivity and security chips to enable design engineers to quickly complete evaluation, prototyping and development of sensor-based applications.
The fully integrated nature of the expansion board enables seamless hardware interoperability between multiple Infineon MCUs and sensors. Key products include the XENSIV™ 60 GHz radar, PAS CO2, pressure, PDM microphone, IMU accelerometer, and the Sensirion SHT35 humidity and temperature sensor. It also integrates seamlessly with Infineon's microcontroller suite and is conveniently accessed via the Arduino Uno connector.
Philipp von Schierstädt, Executive Vice President and Chief Strategy Officer for Consumer, Computing and Communications at Infineon Technologies, said: "We are delighted to be working with Sensirion. Together, the two companies can expand their product range and reduce the workload of application designers. With this new sensor expansion board, customers have the opportunity to develop smart home applications such as heating, ventilation and air conditioning (HVAC) within Infineon's ecosystem and gain access to additional sensors beyond the company's portfolio of consumer sensors (microphones, pressure sensors, CO2 and radar sensors)."
To further accelerate time-to-market and improve the customer experience, the XENSIV™ Sensor Expansion Board fully supports integration with Infineon's ModusToolbox™ software development platform, which provides a comprehensive development environment with all the tools and resources needed for embedded system development. Its built-in code generation and configuration wizards automate repetitive tasks and simplify complex configurations, thus increasing development efficiency.
This new sensor expansion board from Infineon Technologies AG is expected to be available in the third quarter of 2024. As the market for smart home and consumer applications continues to grow, the expansion board will be an important tool for designers and developers to accelerate the innovation and development of sensor-driven solutions.
This latest innovation from Infineon Technologies AG not only demonstrates its leadership in semiconductor technology, but also provides powerful new tools for developers of smart home and consumer electronics applications. With the availability of this expansion board, we look forward to seeing more innovative smart sensor solutions emerge to further enrich our smart living experience.
