To meet the growing demand for high-performance computing and accelerate product innovation cycles, Synopsys, a leading global provider of electronic design automation (EDA) software, has partnered with Intel Foundry to deliver a production-ready multi-die reference flow.
The multi-chip reference flow was developed specifically for Intel Foundry's manufacturing needs. The process combines Synopsys' deep EDA expertise with Intel Foundry's silicon manufacturing expertise to provide designers with an efficient and reliable solution to support complex multi-chip system designs.
As compute-intensive applications such as AI, autonomous driving assistance systems (ADAS), hyperscale data centers, and high-performance computing continue to grow, the demand for high-performance chips is increasing. However, these applications often have extremely high requirements for chip integration, power consumption, and performance, and traditional single-chip design solutions can no longer meet these requirements.
In this case, a multi-chip package (chiplet-based) design approach has emerged. By packaging multiple chips with different functions together, higher levels of integration, lower power consumption, and better performance can be achieved. However, multi-chip designs also bring new challenges, such as communication between chips, power management, thermal management, and other issues.
Figure:Synopsys Accelerates the Pace of Silicon Innovation
To address these challenges, Synopsys has partnered with Intel Foundry to launch a production-ready, multi-chip reference flow. This process supports the entire process from chip design to manufacturing, including chip design, simulation verification, physical verification, packaging design and other links. Through this process, designers can perform multi-chip designs more efficiently and ensure the correctness and reliability of the design.
It is worth mentioning that the reference process is production-ready. This means that designers can use the process directly for chip production without extensive modifications or adjustments. This dramatically reduces time-to-market and lowers overall costs.
In addition, the reference flow integrates advanced packaging techniques and software optimization methods. By optimizing communication between chips and power management, the performance and reliability of the system can be further improved. At the same time, the process also supports thermal management functions, which can ensure the stable operation of the chip in a high-temperature environment.
In summary, Synopsys' production-ready multi-chip reference flow in partnership with Intel Foundry brings significant innovation to the semiconductor industry. This process not only solves a range of challenges in multi-chip designs, but also improves the performance and reliability of the chips and reduces production costs. With the widespread application of this process, it is believed that it will promote the continuous development and innovation of the semiconductor industry.
