ACM Research, Inc. is a provider of solutions focused on semiconductors and advanced wafer-level packaging. Recently, the company introduced the Ultra C BEV-P bevel etching tool for fan-out panel-level packaging (FOPLP) applications. Designed for bevel etching and cleaning in copper-related processes, the new equipment is capable of beveling both sides of the panel in the same system, improving process efficiency and product reliability.
Dr. David Wang, President and CEO of ACM, said, "FOPLP is gaining traction as a solution due to its significant advantages in terms of integration density, cost-effectiveness, and design flexibility to meet the growing demands of modern electronics. Our Ultra C BEV-P tool leverages ACM's deep experience in wet processing to deliver advanced technical performance. It was one of the first tools to support double-sided bevel etching and was designed for horizontal panel applications. We believe that Ultra C BEV-P, along with the recently released Ultra ECP ap-p electrochemical plating tool and Ultra C vac-p flux cleaning tool, will drive advanced packaging technology on large panels, thereby contributing to the growth of the FOPLP market.”
The Ultra C BEV-P tool, which plays a key role in the FOPLP process, uses wet etching technology and is specifically designed for bevel etching and the removal of copper residues. This process is essential to prevent electrical short circuits, reduce the risk of contamination, and ensure the integrity of subsequent treatment steps, thus ensuring the long-term reliability of the equipment. At the heart of the tool's patented technology is ACM's ability to effectively address the unique challenges posed by square panel substrates.
Figure: ACM introduces an inclined etching tool
Unlike traditional round wafers, ACM's innovative design ensures that the etching process can be precisely controlled in the beveled area, even on warped panels. This is critical to maintaining process accuracy and achieving the high performance and reliability required for advanced semiconductor technologies.
Main features of the product:
Suitable for a wide range of panel substrates: Compatible with organic, glass and bonded panels, the Ultra C BEV-P tool efficiently handles the front and back sides of panels and is suitable for panels ranging in size from 510 mm x 515 mm to 600 mm x 600 mm and thicknesses from 0.5 mm to 3 mm.
Handling of warped panels: Panels with a warpage of up to 10 mm can be processed to ensure optimal processing conditions.
Advanced panel handling: Equipped with a single robotic system, the panels are safely and precisely transported and handled.
Efficient Copper Removal: Efficient removal of copper residue using a mixture of dilute sulfuric acid and peroxide (DSP) includes a DI water rinse and N2 drying step to ensure a clean and dry surface.
High throughput: Equipped with up to six processing chambers and capable of processing up to 40 panels per hour (PPH), the Ultra C BEV-P is ideal for high-volume production.
In addition, the system's bevel control accuracy of ±0.2 mm, control range of 0-20 mm, mean time between failures (MTBF) of 500 hours, and 95% uptime ensure excellent reliability and operational efficiency.
