With the rapid development of the automotive industry towards electrification and intelligence, advanced packaging technology plays an increasingly important role in the next generation of vehicles. From improving chip performance to enhancing data processing capabilities, advanced packaging technologies are revolutionizing the automotive semiconductor industry.
Technological innovation: the perfect combination of high power density and high efficiency
In the field of new energy vehicles, high power density and high efficiency are the core goals pursued by power modules. To this end, industry leaders such as VisIC Technologies, Heraeus Electronics and PINK GmbH Thermosysteme have joined forces to launch a revolutionary high-power-density power module. The module uses gallium nitride (GaN) devices and silicon nitride (Si₃N₄) ceramic substrates, combined with a low-temperature silver sintering process, to achieve faster switching speeds and higher power handling capabilities than traditional silicon-based devices. This innovation not only improves the range and charging efficiency of electric vehicles, but also lays a solid foundation for the popularization of new energy vehicles.
The trend of system-in-package and integration is accelerating
With the continuous improvement of automotive intelligence, system-in-package (SiP) and integration technology had become important ways to improve the performance of automotive electronic systems. By integrating multiple chips and components into a single package, SiP technology significantly reduces the length of the interconnect and signal interference between systems, improving the overall performance and reliability of the system. In the next generation of automobiles, SiP technology will be widely used in intelligent driving, in-vehicle entertainment, body control and other fields, promoting the comprehensive upgrade of automotive electronic systems.
Figure: Advanced packaging for next generation vehicle
Chiplet and Heterogeneous Integration: Building a High-Performance Computing Platform
In the face of the urgent demand for high-performance computing capabilities in intelligent driving systems, chiplet technology and heterogeneous integration solutions came into being. Chiplet technology splits large chips into multiple chiplets and integrates them together through advanced packaging technology to achieve greater flexibility and scalability. At the same time, heterogeneous integration solutions integrate different types of chips (such as CPU, GPU, FPGA, etc.) together to form a powerful high-performance computing platform. These technologies will help increase the computing power of next-generation vehicles to meet the needs of complex applications such as intelligent driving.
The market application prospect is broad
The rapid development of advanced packaging technology not only promotes the progress of automotive technology, but also brings a broad space for the development of related industrial chains. In the field of intelligent driving, the combination of high-performance computing platforms and advanced sensor technologies will promote the further maturity of autonomous driving technology. In the field of in-vehicle electronics, the integration of more types of chips and components will improve the functionality and user experience of automobiles. In the field of new energy vehicles, power modules with high power density and high efficiency will help improve the range and performance of electric vehicles.
Advanced packaging technologies for next-generation vehicles are revolutionizing the entire industry. With the continuous advancement of technology and the continuous expansion of the market, these innovations will play an increasingly important role in the future of automobiles. At the same time, it will also stimulate more enterprises to devote themselves to the research and development and application of advanced packaging technology, and jointly promote the technological innovation and industrial upgrading of the automotive industry.
