In the wave of artificial intelligence (AI), the advancement of chip technology has become a key force to promote the development of the industry. According to Morgan Stanley analyst Charlie Chan and others mentioned in the report, Apple's upcoming M5 series chips will use TSMC's most advanced SoIC-X packaging technology, heralding another leap in AI server performance.
TSMC SoIC Technology: The Frontier of 3D Packaging Technology
TSMC's SoIC (System on Integrated Chip) technology is part of the 3D Fabric technology portfolio and represents the forefront of 3D packaging technology. SoIC technology allows for high-density vertical stacking between chips, with bump pitches as low as 6um, which is the highest accuracy among current packaging technologies. This design not only provides higher packing density and smaller bonding spacing, but can also be used with CoWoS and InFo technologies to enable smaller die sizes and integration of multiple chiplets.
Apple M5 chip: a new benchmark for AI computing power
Apple's M5 series chips are expected to achieve mass production in the second half of 2025, when TSMC will significantly increase SoIC production capacity to meet Apple's demand. Currently, the M2 Ultra chips used by Apple in its AI server cluster are expected to reach around 200,000 this year, which shows Apple's investment and ambition in the field of AI.
The launch of the M5 chip will further strengthen Apple's position as an AI computing power provider. M5 chips with SoIC-X packaging technology are expected to provide higher performance and energy efficiency to meet the growing demand for computing power in the AI era.
Figure: Apple M5 is exposed for the first time and will use TSMC SoIC-X packaging technology
The co-evolution of technology and market
The cooperation between Apple and TSMC is not only a technological leap, but also a precise layout of market strategy. With the rapid development of AI technology, the demand for high-performance computing platforms is increasing. By adopting SoIC technology, Apple is not only able to provide more powerful AI computing power, but also to maintain a leading position in a highly competitive market.
At the same time, TSMC, as the world's leading semiconductor foundry, will further promote the technological progress and industrial upgrading of the entire semiconductor industry through the commercial application of its SoIC technology. It is expected that by 2025, the market share of advanced packaging technology will further increase, and 2.5D/3D packaging will grow the fastest, with a compound annual growth rate of 14.34%.
Summary
The combination of Apple's M5 chip and TSMC's SoIC technology is an inevitable product of technological development in the AI era. This cooperation will not only bring more powerful AI computing power to Apple, but also bring new growth points to TSMC. However, as technology continues to advance, how to balance cost, performance and energy efficiency, and how to ensure the stability of the supply chain will be a challenge that Apple and TSMC need to face together.
With the launch of the M5 chip, we look forward to seeing the arrival of a more intelligent and efficient era of AI computing. This is not only a victory for Apple and TSMC, but also a progress for the entire technology industry. In this technological marathon, only by continuous innovation and evolution can we be invincible in the AI era.
