As the semiconductor industry continues to pursue high performance, low power consumption, and flexibility, chiplet technology is emerging as the key to achieving these goals. Against this backdrop, Baya Systems and Blue Cheetah have announced a partnership to deliver advanced chiplet interconnect solutions to drive innovation and growth in the industry.
Blue Cheetah, a leader in die-to-die (D2D) connected IP solutions, has been providing chiplets with rapidly customizing connected IP. Its BlueLynx D2D interconnect IP has enabled successful silicon bring-up on 12nm test chips and is widely used in data center, networking, and AI applications. BlueLynx IP solutions currently support a variety of process technologies, including 5nm, 7nm, 12nm, and 16nm, to meet the needs of different customers.
Baya Systems, on the other hand, is known for its interconnect tools for chip-on-chip and complex system-on-chip (SoC) designs. Its WeaveIP solution provides the components needed to build a unified fabric with an efficient, scalable transport architecture that maximizes performance and throughput while reducing latency, silicon footprint, and power consumption. WeaveIP also supports a variety of standard protocols such as CHI, ACE5-Lite, AXI5, etc., and can be extended to other protocols including CXL, providing designers with great flexibility.
The collaboration between Baya Systems and Blue Cheetah brings together their technical expertise to bring new solutions to chiplet interconnect technology. By combining Blue Cheetah's BlueLynx D2D interconnect IP and Baya Systems' WeaveIP solution, the parties will be able to optimize data transmission and interaction in chip designs, further improving system performance and reducing power consumption and silicon footprint.
Figure:Baya Systems Partner with Blue Cheetah Provide Chip Interconnect Solutions
This cooperation will bring an important impetus to the development and application of chiplet technology. As the demand for high performance, low power consumption, and flexibility continues to grow in areas such as data centers, networking, and AI, chiplet technology will be key to achieving these goals. The collaboration between Baya Systems and Blue Cheetah will enable us to provide customized chiplet interconnect solutions that meet the needs of different customers and drive innovation and growth across the industry."
The cooperation between the two parties will not only accelerate the commercialization of chiplet technology, but also promote the development of related industry chains. By jointly developing and promoting advanced chiplet interconnect solutions, Baya Systems and Blue Cheetah will attract more customers and partners to join the field, forming a closer partnership to drive the prosperity and development of the semiconductor industry.
In conclusion, Baya Systems' partnership with Blue Cheetah will usher in a new chapter in chiplet interconnect solutions. The two parties will work together to promote the development and application of chiplet technology and bring a better future to the semiconductor industry.
