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The independent development of China's semiconductor industry will increase, where will the 344bn yuan go?

The official establishment of the National Integrated Circuit Industry Investment Fund III (referred to as "National Fund III") marks China's independent development of the semiconductor industry again.The registered capital is as high as 344 billion yuan, which not only far exceeds market expectations, but also reflects the country's attention and determination to the semiconductor industry.

The establishment background of the third phase of the national Grand FundThe establishment of the third phase of the National Grand Fund is China's latest effort to achieve chip self-sufficiency in the context of the current intensifying competition in the global semiconductor industry and the complex international situation.The move shows China's determination to develop its own semiconductor industry and is expected to boost the overall development of the domestic integrated circuit industry.

Figure: The independent development of China's semiconductor industry further increases, where will 344 billion Yuan go?

Figure: The independent development of China's semiconductor industry further increases, where will 344 billion Yuan go?

Investment areas and priorities

The investment focus of the third phase of the National Grand Fund is expected to cover the following key areas:

1.Semiconductor manufacturing: As the core of the industrial chain, the semiconductor manufacturing sector will continue to receive key investments to enhance domestic capacity and technology levels.

2.Equipment and materials: Semiconductor equipment and materials are technically difficult and strategically significant links in the industrial chain, and are expected to receive the key investment of the third phase of the large fund.

3.Artificial intelligence semiconductor: With the rapid development of AI technology, AI chips have become a key node in the industrial chain and may become the investment focus of the third phase of large funds.

4.Advanced packaging technology: Advanced packaging technology is an important means to improve chip performance and reduce costs, and is expected to receive attention and investment.5.Third generation semiconductor: The third generation semiconductor materials represented by silicon carbide (SiC) and gallium nitride (GaN) may become a new direction of investment because of their advantages in high temperature, high frequency, high efficiency and other aspects.

Specific projects and companiesAlthough the specific investment projects of the third phase of the National Grand Fund have not been fully disclosed, according to the investment strategy and market trends of the first two phases, the following are some possible investment areas and potential benefit companies:

1.Smic: As a leading domestic chip manufacturer, SMIC is likely to continue to receive support from large state funds to promote its research and development of advanced process technologies and capacity expansion.

2.Shanghai Huahong: Focusing on chip manufacturing with characteristic processes, Shanghai Huahong is expected to secure investment to strengthen its competitiveness in specific semiconductor sectors.

3.Changjiang Storage: As a major domestic memory chip manufacturer, Changjiang Storage may receive financial support to accelerate the development of its 3D NAND technology.

4.Unigroup: As a leading chip design company, Unigroup is likely to benefit from investment from large funds to boost its 5G and AI chip research and development.

5.Naura: As a semiconductor equipment supplier, NAURA may receive financial support to strengthen its technology and market position in areas such as etching machines and thin film equipment.

Technological progress and innovationThe investment of the third phase of the National Grand Fund will not only be limited to financial support, but also promote technological progress and innovation in the semiconductor industry.In particular, in the following areas:1.Process technology: Driving the development of more advanced process technology, such as 7 nm, 5 nm and even smaller chip manufacturing processes.

2.Heterogeneous integration: Support heterogeneous integration technology in chip design to achieve efficient collaboration of different functional modules.

3.New material application: Promote the commercial application of third-generation semiconductor materials, such as in electric vehicles, renewable energy and other fields.

4.EDA Tools: Support the development of electronic design automation (EDA) tools to improve the efficiency and accuracy of chip design.

Sum up

The establishment of the third phase of the National Fund indicates that China's semiconductor industry will usher in a new round of development opportunities.By focusing on key areas, promoting technological innovation, and building an industrial ecology, China is expected to occupy a more important position in the global semiconductor industry.At the same time, this initiative will also contribute China's strength to the development of the global semiconductor industry and promote global scientific and technological progress and economic growth.


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