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With Hundreds of Millions in Series B Funding Secured, SiEngine 'Dragon Eagle One‘ is Ready to Soar

Recently, Hubei SiEngine Technology successfully completed hundreds of millions of yuan in Series B financing. The funds will be used for the further mass production and supply of the 7-nanometer automotive grade chip "Dragon Eagle One" that has been supplied on a large scale. The market promotion of the high-end smart cockpit and cabin-parking integrated solution, as well as the testing, verification and market introduction of the new full-scenario high-end smart driving product AD1000.

"Dragon Eagle One" is China's first 7nm car-grade smart cockpit chip. It has high performance, high computing power, high integration, and low power consumption. It can support an integrated cabin and parking solution with a single chip. At the same time, the chip uses core Qing Technology's innovative SE-LINK cascade solution can enable the dual "Dragon Eagle One" to exert greater performance advantages, further enhance the immersive experience of the cockpit, and improve the safety and convenience in the era of smart driving.

Picture: SiEngine Technology’s “Dragon Eagle One” is China’s first 7nm car-grade smart cockpit chip

Hubei SiEngine Technology Co., Ltd. is committed to becoming China's leading high-performance automotive grade processor overall solution provider. The company was established in Wuhan Economic and Technological Development Zone in 2018 and has R&D and sales branches in Wuhan, Beijing, Shanghai, Shenzhen, Shenyang and Chongqing. It focuses on designing, developing and selling advanced automotive electronic chips to "let everyone "Everyone can enjoy the pleasure of driving" is our development mission and we are committed to becoming the world's leading provider of overall automotive electronic chip solutions.

Dr. Wang Kai, founder, director and CEO of SiEngine Technology, said, "The second phase of the national-level fund's leading investment demonstrates the national fund's in-depth understanding of the industry, strong support for leading chip companies and investment leadership. SiEngine Technology is committed to enhancing its ability to benchmark against international first-class standards in the field of domestic high-end automotive chips, filling domestic gaps, and providing the best cost-effective solutions to OEMs. This round of financing will help maintain our competitive advantage and further enhance the market for domestic chips. Market share is crucial. We will work more closely with industry chain partners to accelerate innovation in the field of smart cockpits and smart driving, improve supply chain security, and promote intelligent transformation and high-quality development of automobiles.”

This round of financing is a new round of capital injection received by SiEngine Technology after the "Dragon Eagle One" was supplied in batches to a number of hot-selling models and received strong market response. Prior to this, the financing funds obtained by SiEngine Technology came from diversified investors, covering automobile OEMs, upstream and downstream partners in the industry chain, as well as important national funds and government investors. The intensive continuous recognition and support from diversified investors shows that SiEngine Technology's product competitiveness and commercialization capabilities in the high-end automotive chip track have been fully recognized by customers and tested by the market, thus gaining wide recognition from the industry and capital circles.

Thanks to the excellent performance of "Dragon Eagle 1", the market performance of the models equipped with it has attracted attention. As of the end of 2023, the shipment volume of "Dragon Eagle One" has exceeded the 200,000 pieces mark. With the huge sales of the popular model Lynk & Co 08, SiEngine Technology’s innovative strength and leading position in the field of domestic high-end car-grade chips have been further confirmed, breaking the situation that the field of high-performance smart cockpit SoC has been monopolized by foreign brands, and providing Chinese car companies provide brand new options.

At the same time, the architectural advantages of "Dragon Eagle One" enable the rapid porting of different operating systems, and have empowered more than 20 designated main models of many mainstream car manufacturers. A number of cooperation projects established by SiEngine Technology with domestic and foreign first-tier automotive suppliers are progressing smoothly, and the market penetration rate of high-end "Chinese cores" is growing. It is expected that in 2024, the shipment volume of "Dragon Eagle One" will reach 100 On the order of 10,000 pieces.

The "Dragon Eagle One" single-chip cabin, parking and integrated solution is rapidly gaining popularity, helping car companies reduce costs and increase efficiency.

The integration of cabin, cabin and parking is an important trend in the new wave of automobile intelligence, in which domestic high-end chips will play an important role. The powerful heterogeneous computing power of "Dragon Eagle 1" is sufficient to handle the multi-task scenario of cabin parking. Its technological innovation and independent controllability can not only enhance the core competitiveness of China's smart car industry, but also provide global smart car chips. The market brings more diversified choices and more cost-effective solutions.

With "Dragon Eagle One" as the powerful performance base, the integrated cabin and parking computing platform aims to provide an end-to-end software and hardware integrated cabin and parking solution. Through an open architecture, it provides ecological integration and solution expansion for multi-scenario applications. The platform will help OEMs and partners simplify design, reduce development and deployment costs, and quickly meet market demand through comprehensive and complete hardware composition, flexible software deployment, and open and optimized reference designs.

The partner's cross-domain integrated computing platform based on "Dragon Eagle One" has been officially unveiled at the 2024 CES exhibition. It can cover the three control domains of smart cockpit, smart assisted driving and automatic parking, significantly reducing costs. Provide highly competitive solutions for OEMs to help OEMs reduce costs and increase efficiency.

SiEngine has a comprehensive layout from smart cockpit to smart driving, seizing the "new high ground" of domestic high-computing power automotive chips

High-end autonomous driving places higher requirements on core chips in terms of performance, power consumption, integration, safety and reliability. The Dragon Eagle smart driving chip AD1000, which is about to be launched by SiEngine Technology on the market, benchmarks against the most advanced smart driving products in the international market and surpasses it in terms of CPU performance, AI computing power, ISP processing power, and NPU local storage capacity.

AD1000 still uses 7nm automotive-grade technology and complies with AEC-Q100 standards. The multi-core heterogeneous architecture enables powerful intelligent driving computing power: CPU computing power reaches 250+ KDMIPS, NPU dense computing power reaches 256 TOPS, and multi-chip collaboration can achieve up to 1024 TOPS. computing power. AD1000 integrates high-performance VPA and ISP, has a built-in ASIL-D functional safety island, and has rich interfaces, which can fully meet the needs of L2 to L4 intelligent driving. SiEngine Technology is committed to building an open algorithm and ecosystem to provide domestic high-end autonomous driving full-stack solutions for Chinese and international car manufacturers.

After this round of financing, SiEngine Technology will continue to make efforts in the field of high-performance car-grade chips, and through a complete product layout from smart cockpits to smart driving, it will strongly support the evolution of cabin-driving integrated technology architecture and the development of automobile intelligence. At the same time, SiEngine Technology will work with ecological partners to jointly build an impact-resistant, sustainable, safe and stable automotive chip supply chain system to help car companies win opportunities in fierce competition and continue to bring wisdom to consumers. Upgraded travel experience.

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