Chip interconnect technology, as one of the key technologies in the semiconductor industry, is of great significance for improving chip performance, reducing costs, and promoting technological innovation.
Chip interconnect technology, in short, refers to the connection of chip modules with different functions or processes in a specific way to achieve a more efficient and flexible electronic system. With the continuous progress of semiconductor processes and the increasing complexity of chip design, the traditional single-chip design model has been difficult to meet the increasing performance and power consumption requirements. As a result, chip interconnect technology has emerged, opening up a new path for chip design.
Chip interconnect technology has gone through multiple stages of development from wire bonding and flip chip bonding to through-silicon via (TSV) bonding and chiplet technology. Each technology has its own unique advantages and scope of application. For example, wire bonding has taken its place in mobile devices due to its cost-effectiveness and reliability; Flip chip bonding has become the preferred choice for high-performance chips such as CPUs and GPUs due to its shorter electrical path and higher data processing speed. TSV technology realizes the three-dimensional stacking of chips through vertical interconnection, which further improves the integration and performance of the system. Chiplet technology splits and recombines chips with different functions according to needs, which greatly improves the flexibility and efficiency of design.
Figure: Chip interconnection technology, splicing the next generation of chips
With the rise of technologies such as chiplets, the industry urgently needs a unified set of interconnection standards to ensure that chips from different vendors and different process nodes can be smoothly interconnected and integrated. To this end, the UCIe (Universal Chiplet Interconnect Express) standard, which was jointly established by a number of chip giants, came into being. The emergence of the UCIe standard not only provides a unified interface specification for chip interconnection, but also promotes the division of labor and cooperation in the industrial chain and accelerates the industrialization process of chiplet technology.
The development of chip interconnect technology will have a profound impact on the next generation of chips. First, it will drive flexibility and diversity in chip design. Through chiplet and other technologies, designers can freely combine and optimize chip modules with different functions according to actual needs, so as to create chip products that are more in line with market demand. Secondly, it will promote the division of labor and cooperation in the chip industry. Driven by standards such as UCIe, different vendors can focus on R&D and production in their own areas of expertise, and then integrate their respective achievements through interconnect technology to form a complete system-on-chip. This division of labor and cooperation will help to improve the efficiency and competitiveness of the entire industry. Finally, it will provide new ideas for the continuation of Moore's Law. As semiconductor processes approach their physical limits, traditional approaches to improving performance by reducing transistor size have faced many challenges. Chip interconnect technology provides a new way to improve chip performance by changing the packaging method, increasing the data transmission rate and reducing power consumption.
As one of the key technologies in the semiconductor industry, chip interconnection technology is of great significance for promoting technological innovation, improving chip performance and reducing costs. With the continuous development and innovation of technology, chip interconnect technology will continue to be updated and iterated to meet people's growing needs.
