On April 22, 2025, it was reported that a liquid cooling technology developed by Georgia Tech recently obtained a U.S. patent. Designed to address long-standing overheating in electronic devices and high-performance computing, the technology provides an innovative solution to the thermal challenges of AI processors and data centers.
1. Microfluidic cooling system: solve heat dissipation from the source of the chip
Developed by Daniel Lorenzini, a Ph.D. in mechanical engineering at the Georgia Institute of Technology, the technology centers on microfluidic channels embedded in chip packages — tiny, complex paths for liquid flow. The cooling system uses fluids in micro-pin fins to quickly remove heat by attaching it directly to the silicon chips that generate the most intense heat. "Our solution targets the heat source of the silicon chips directly, so we can dissipate heat more efficiently," Lorenzny said.”
Compared to traditional cooling methods (e.g., fans, heat sinks), the system deeply integrates the cooling module into the electronic components, significantly improving the thermal dissipation efficiency. Experiments show that it not only greatly reduces the risk of equipment overheating, but also reduces power consumption, providing a guarantee for the continuous and stable operation of high-computing power equipment.
2. From Lab to Commercialization: Exploration of the Landing of Startup EMCOOL
With the support of the Georgia Institute of Technology's Office of Commercialization's VentureLab program, Lorenzny has turned his research findings into a start-up, EMCOOL, headquartered in Norcross. Currently, EMCOOL's five-person team is actively seeking venture capital to scale up the technology to address the growing thermal management challenges of AI processors in modern data centers.
Figure:Georgia Tech Has Been Awarded a U.S. Patent for Liquid Cooling Technology
The core components of this cooling system include:
Microneedle fin cooling block: one side is covered with tiny needle-like fins, and the other side is covered with special thermal interface material;
Fluid Interface: Inlet and outlet ports matched to the shape of the fins ensure efficient fluid flow and achieve chip-level heat export.
3. Application Scenarios: Broad potential from gaming to data centers
While the technology was initially focused on the $159 billion global video game market (addressing the heat and latency issues caused by high computing power), EMCOOL's horizons have expanded to include more areas. Jonathan Goldman is the director of the Georgia Tech Office of Commercialization, Quadrant-i, and under his direction, Lorenzny received grants through the National Science Foundation and the Georgia Research Consortium for further research and building design prototypes. "Thermal management is a common problem in the computer industry, and when we saw Daniel's results, we immediately realized the business potential," Goldman said. ”
In addition to gaming, the technology can be applied to:
High-performance computing (HPC): Solving the problem of overheating AI processors in data centers;
Telecom equipment: ensure the stable operation of high-load equipment such as 5G/6G base stations;
Energy systems: Optimizing the heat dissipation efficiency of EV battery management systems.
4. Industry impact: Microfluidic technology promotes the heat dissipation revolution
Goldman commented, "By utilizing microfluidic technology, EMCOOL's system provides a compact and energy-efficient way to dissipate heat, pushing the boundaries of traditional cooling technologies. With the explosion of demand for AI and high-performance computing, thermal management has become a key constraint on hardware performance. With its high efficiency and integration, this patented technology is expected to revolutionize heat dissipation technology in data centers, autonomous driving, cloud computing, and other fields, laying the foundation for performance breakthroughs in next-generation electronic devices.
As EMCOOL accelerates the commercialization of its technology, Georgia Tech's innovation could redefine the global electronics industry's thermal standards and provide a sustainable solution to the industry's "overheating" challenge.
