GlobalFoundries (GF) and NXP Semiconductors have announced a collaboration to drive next-generation solutions in core markets such as automotive, IoT and smart devices. The collaboration will leverage GF's 22FDX® technology platform focused on optimizing power, performance and time-to-market, and products will be manufactured at GF's facilities in Dresden, Germany and Malta, New York, United States, providing geographically distributed supply chain assurance.
This collaboration builds on the long-standing relationship between the two companies and enables NXP to deliver more compact and energy-efficient solutions while improving overall system performance. The 22FDX platform is designed for edge intelligence, enabling ultra-low power consumption and high performance by dynamically adjusting voltage levels. Compared to other planar CMOS technologies, 22FDX offers up to 50% higher performance and up to 70% lower power consumption.
Andy Micallef, executive vice president and chief operating and manufacturing officer, NXP, said: "NXP's high-performance innovative solutions are at the heart of enabling an increasingly connected world. The energy-efficient features and enhanced performance of GF's 22FDX platform enable our customers to develop the next generation of secure, connected solutions. In addition, GF's manufacturing capabilities in Germany and United States help us achieve geographic resilience and control of our supply chain.”
Highlighting the strong foundation of our more than 10-year partnership, Niels Anderskouv, chief commercial officer at GF, said, "Our close collaboration is a testament to the power of our shared vision and commitment. "In the future, we will continue to drive NXP's next-generation solutions that deliver high performance and optimal performance without sacrificing any aspect of the need."
Figure: GF Technologies and NXP propose IoT solutions
The 22FDX platform maximizes performance per unit area by integrating digital, analog, RF, power management, and non-volatile memory (NVM) onto a single chip. Its advanced RF connectivity technology provides responsive, reliable wireless connectivity for simple and secure communication. The integrated NVM not only reduces power consumption and latency, but also improves security, especially for edge AI processors with increasing memory requirements. With this integration, NXP will provide a one-stop solution for multiple markets while maximizing IP design reuse.
In addition, 22FDX technology is compliant with automotive Tier 1 and Tier 2 application standards and is capable of providing superior reliability under extreme conditions. As part of GF's AutoPro™ solution, the 22FDX platform supports junction temperatures up to 150°C, which is critical to ensuring the long-term durability and safety of in-vehicle electronic systems.
With a broad portfolio of FDX innovations and proven IP, GF supports automotive, communications and IoT applications. The company has shipped more than 3 billion FDX chips worldwide from its Dresden facility and is now also shipping from its Malta, New York facility. "Following the two companies' collaboration on 40nm NVM technology, GF will continue to innovate the FDX and FDX+ platforms to support NXP's next-generation solutions in the coming years."
