Recently, a research team led by Prof. Chu Zhiqin and Prof. Lin Yuan of the University of Hong Kong, in collaboration with Prof. Li Guixi of Southern University of Science and Technology and Prof. Wang Qi of the Dongguan Institute of Optoelectronics of Peking University, has developed a novel method for the large-scale production of ultra-thin and ultra-flexible diamond films. This breakthrough technology is expected to bring about significant changes in several fields, including electronics, photonics, acoustics, quantum technology, and more.
A breakthrough in new technology: making diamond films "softer"
Diamond, the hardest natural material on earth, is often used in high-end applications such as high-frequency electronics, lasers, and heat sinks. However, the rigid and solid structure of diamond makes it very complex to produce and process, especially to create a diamond film that is both thin and soft.
The research team used an innovative "edge-exposed peel method" that enables the rapid production of ultra-thin, ultra-flexible diamond films that are more efficient and cost-effective than traditional production methods. While traditional production methods typically take longer, are more expensive, and produce diamond films of limited size, the new method can produce wafers with a diameter of 2 inches in as little as 10 seconds and a more uniform film quality. This new process greatly increases production efficiency and paves the way for large-scale application.
Wide range of application prospects
The ultra-flat surface of this new diamond film is important for high-precision microfabrication. Not only is it extremely stiff, but it is also very flexible, which means that it can be used to make the next generation of flexible electronics and photonic devices, especially those wearables that require high precision and performance.
For example, ultra-thin diamond films can be used to improve the heat dissipation performance of electronic devices and help high-power electronic components such as semiconductor processors and lasers dissipate heat better. It can also be applied to optical communications, quantum technology and other fields to promote the further development and commercialization of these technologies.
Figure: Diamond film technology breakthroughs: driving new changes in the semiconductor industry (Source: Nature).
Future Prospects: The "Flexible Era" of Diamond
"With this new technology, we hope to promote the wide application of high-quality diamond films in various fields, especially in the semiconductor industry, and set new standards for the industry," said Professor Chu Zhiqin. We look forward to working with our partners in academia and industry to bring this revolutionary technology to market and accelerate the use of diamond in modern technology." ”
The unique advantages of diamond
Not only is diamond the hardest natural substance, it also has some amazing properties: it has the highest thermal conductivity of any material, extremely high electron mobility, strong dielectric breakdown strength, and optical transparency covering a wide range of wavelengths, from infrared to ultraviolet. These properties make diamond ideal for use in the manufacture of high-power, high-frequency electronic devices and heat sinks.
For example, heat management in electronics has always been a challenge, especially in high-power-density components such as processors and lasers. As an ideal heat dissipation material, diamond can effectively solve this problem, helping electronic components to cool better, extend service life and improve performance.
Summary
This breakthrough diamond film production technology not only solves many problems in traditional diamond manufacturing, but also opens up a new application space for future high-tech fields. With the gradual promotion of this technology, diamond will play an increasingly important role in many fields such as electronics, photonics, and quantum technology. In the future, ultra-thin ultra-soft diamond film will likely become an important engine to promote scientific and technological progress.
