According to the latest news released on Infineon's official website, the company recently launched two new dual-phase power modules - TDM2354xD and TDM2354xT, which are designed to support high-performance AI computing. With their ultra-high-voltage current density, these modules provide best-in-class power density for AI data centers, enabling true vertical power delivery (VPD) and industry-leading 1.6A/mm2 current density.
Vertical power delivery is a power delivery technology designed for high-performance processors. It reduces the resistance of the power delivery network by deploying the current multiplier module directly below the processor to meet the processor's low voltage requirements for high currents. This design helps reduce losses on the system's PCB and frees up trace space for the upper PCB for high-speed I/O and memory.
At present, vertical power delivery technology is mainly used in high-performance computing, artificial intelligence, data centers, servers, and other fields, and these application scenarios require efficient energy transmission to meet the high-performance requirements of processors. By placing the power supply directly below the processor, the vertical power delivery technology provides a more stable and efficient power delivery path, thereby improving the overall performance of the system.
Data centers are an important carrier for the realization of modern informatization and the foundation of the digital economy, playing an important role in cloud computing, 5G, artificial intelligence and other fields. According to market research, with the development of artificial intelligence, the energy consumption of data centers is expected to grow from 2% of global energy consumption currently to about 7% by 2030, which is equivalent to the current energy consumption of India. Therefore, enabling efficient power conversion from the grid to the core is critical to achieving higher power density, improving computing performance, and reducing total cost of ownership.
Figure: Infineon enables AI high-performance computing
Infineon's TDM2354xD and TDM2354xT modules combine Infineon's powerful OptiMOS™ 6 trench technology, embedded chip packaging for superior power density through improved electrical and thermal efficiency, and new inductive technology for lower profile and true vertical power delivery. These modules set a new standard for computing performance and efficiency in AI data centers.
The TDM2354xT module supports currents up to 160A and is the industry's first Trans-Inductor Voltage Regulator (TLVR) module in a small 8 x 8 mm² package. Combined with Infineon's XDP™ controllers, they provide extremely fast transient response and reduce on-board output capacitance by up to 50%, further increasing system power density.
These two modules are suitable for the following scenarios:
High-performance computing platforms: Deliver the power density and energy efficiency needed for high-performance computing, especially in AI and machine learning.
AI Data Center: Optimize data center energy use and improve computing performance while reducing energy consumption and operating costs.
GPU platforms: Graphics processing units (GPUs) that support high power requirements, and these platforms are typically used to handle complex AI computing tasks.
Industrial Power Systems: Provide a stable power supply in industrial applications that require high reliability and efficiency.
Automotive Power Applications: With the development of electric vehicles and autonomous driving technology, these modules can provide the required power management solutions for these high-performance applications.
"We are proud to enable high-performance AI data centers with the TDM2354xT and TDM2354xD modules," said Vice President of Power ICs at Infineon. In keeping with Infineon's usual quality assurance, the new equipment maximizes system performance and thus reduces data center costs. In addition, he said, "Leveraging our industry-leading power device and packaging technologies, coupled with extensive system expertise, will further drive high-performance and green computing as part of our mission to drive digitalization and decarbonization."
