Recently, Intel announced that it has partnered with several EDA (Electronic Design Automation) tool vendors to further enhance its EMIB (Embedded Multi-Chip Interconnect Bridge) packaging technology, a move that promises to bring new breakthroughs in high-performance computing and artificial intelligence.
EMIB packaging technology is a revolutionary chip-packaging solution that connects different die dies through silicon bridges, improving the efficiency and performance of the connection between the chips. This technology not only improves the speed of data processing, but also enhances the stability and reliability of the system. As a leader in the semiconductor industry, Intel has been committed to promoting the development and application of EMIB packaging technology.
In order to further improve the design and application efficiency of EMIB packaging technology, Intel has worked closely with a number of partners in the EDA and IP fields to jointly launch a new EDA tool support solution. These EDA tools include products from well-known companies such as Ansys, Cadence, Siemens, and Synopsys, which provide design customers with a complete design solution that ensures that the integration of products such as Intel FPGAs can be efficiently and accurately designed and verified in the system.
With the support of EDA tools, design customers can more easily develop multi-chip designs. These tools offer a wealth of features and flexible options to make the design process more efficient and reliable. For example, Ansys' EDA tools can provide sign-off verification for the thermal integrity, power integrity and mechanical reliability of EMIB technology, ensuring the stability and reliability of the packaging technology. Cadence supports design customers with a complete EMIB 2.5D packaging flow, as well as Intel 18A's digital and custom/analog flow and design IP.
Figure: Intel foundry development EMIB (Source: Intel)
In addition, Siemens also provides an EMIB reference flow for Intel foundry customers to help design customers better understand and apply EMIB packaging technology. Synopsys leverages an AI-driven, multi-chip reference flow to power EMIB's advanced packaging technology. The introduction of these EDA tools and reference flows greatly simplifies the process for design customers to take advantage of EMIB 2.5D advanced packaging, making the development of multi-chip designs more efficient and convenient.
Through close collaboration and continuous innovation with ecosystem partners, Intel not only provides strong support for EMIB packaging technology, but also drives the development of the entire semiconductor industry. This technological innovation not only improves the performance and reliability of products, but also reduces the cost of design and production, bringing more opportunities and challenges to the market.
Intel is leading the revolution in EMIB packaging technology with the support of EDA tools. This technological innovation not only improves the performance and reliability of semiconductor products, but also drives the progress and development of the entire industry. In the future, with the continuous development and innovation of technology, we have reason to believe that Intel will continue to play a leading role in the semiconductor industry and make greater contributions to the progress and development of human society.
