According to reports, MediaTek officially released the Dimensity 9400+ chip. As an advanced version of MediaTek's first 3nm chip, the Dimensity 9400, the Dimensity 9400+ continues MediaTek's strategy of launching an enhanced version of its flagship chip, which is based on TSMC's second-generation 3nm process (N3E), which goes one step further in energy efficiency performance, and even achieves excellent energy consumption control without the need for low-power cores.
In terms of core configuration, the Dimensity 9400+ still adopts the "full performance" core architecture. It comes with one ARM Cortex-X925 core running at up to 3.73GHz, three Cortex-X4 cores at 3.30GHz, and four Cortex-A720 cores at 2.40GHz. Compared to the Dimensity 9400, the CPU frequency of the Dimensity 9400+ has been increased to a certain extent, which can bring a smoother multitasking and gaming experience. Its ARM Immortalis 12-core GPU not only supports ray tracing, but also provides users with more realistic game graphics and smoother graphics.
In terms of storage and connectivity, the Dimensity 9400+ also performs well. It integrates up to 12MB of L3 cache, as well as 10MB of system cache and 10MB of SLC, which, together with LPDDR5X memory and UFS 4.0 storage, greatly improves data read and write speeds, and makes app launches and file loads faster. In terms of network connectivity, it supports Wi-Fi 7 tri-band, with a maximum bandwidth of 7.3Gbps and a Bluetooth 6.0 transmission speed of 12Mbps, which can meet users' needs for high-speed network connection. In terms of display support, the chip can drive WQHD+ resolution, 180Hz high refresh rate screen, bringing smooth visual enjoyment.
Figure: MediaTek officially released the Dimensity 9400+ (Source: Wccftech)
The Dimensity 9400+ supports up to 320MP single camera and video shooting up to 8K 60FPS, which can meet the user's pursuit of high-definition photography. In terms of AI performance, with the help of MediaTek 890 NPU, the chip not only supports device-side generative AI and agent AI applications, but also improves AI processing performance by 20%, bringing users more intelligent experience.
In addition, the Dimensity 9400+ integrates MediaTek Ultrasave 4.0 energy-saving technology, which can effectively extend the battery life of the phone. At the same time, it also natively supports DeepSeek's R1 model, providing more possibilities for the expansion of AI applications.
In terms of market competition, the high-end chip market is highly competitive, and competitors such as Qualcomm Snapdragon are strong. The Qualcomm Snapdragon series has a high reputation and user base in the market, and some products also have advantages in some aspects, and the Dimensity 9400+ needs to continue to make efforts in terms of performance optimization and software adaptation to further seize market share. Despite the performance gains, high performance can introduce power and heat dissipation issues. If these problems cannot be solved well in actual use, it may affect the user experience, lead to frequency reduction, etc., and then affect the reputation of the product.
It is understood that smartphones equipped with Dimensity 9400+ chips are expected to be launched in the second quarter of this year, when consumers can experience the performance upgrades brought by this chip. However, the difference between the Dimensity 9400+ and the Dimensity 9400 is not significant. For consumers looking for extreme performance, the Dimensity 9500, which is expected to be launched in the fourth quarter of this year, may be more exciting.
