Microchip Technology's RTG4™ FPGAs have achieved a significant milestone with the successful Qualified Manufacturers List (QML) Class V qualification for their lead-free flip chip bump design. Designated by the United States Defense Logistics Agency (DLA), this certification represents the highest level of qualification for space components and is a necessary step in mission assurance requirements for mission-critical space missions, including manned space missions, deep space exploration, and national security programs.
Microchip Technology's RTG4™ FPGAs are field-programmable gate arrays designed to maintain performance in extreme radiation environments. These FPGAs combine Microchip's fourth-generation flash-based FPGA architecture with high-performance interfaces, such as SerDes, while maintaining resistance to radiation-induced configuration interference, for applications such as space flight (including low Earth orbit, medium Earth orbit, geostationary orbit, high elliptical orbit, and deep space), high-altitude aviation, medical electronics, and nuclear power plant control.
Figure:Microchips RTG4 FPGAs Achieve Highest Space Qualification
RTG4 FPGAs are the first RT FPGAs to offer more than 150,000 logic elements and qualify for QML Class V. The next-generation solution features lead-free flip chip bumps and is the first to achieve QML Class V status. In the advanced flip chip package architecture used by RTG4 FPGAs, flip chip bumps are used to connect the silicon chip to the package substrate. Lead-free bump materials will help extend the life of the product, which is essential for space missions.
To qualify for QML Class V, RTG4 FPGAs with lead-free bumps undergo extensive reliability testing, withstanding up to 2,000 thermal cycles from -65°C to 150°C junction temperatures. The lead-free flip chip bump interface connection passes MIL-PRF-38535 inspection standards and shows no signs of tin whiskers. Because flip chip bumps are located inside the FPGA package, there is no impact on the user's design and reflow profiles, thermal management, or board assembly flow when transitioning to a lead-free bumping RTG4 FPGA.
RTG4 FPGAs are designed to bring high density and performance to space applications, saving cost and engineering effort through low power consumption and immunity to configuration interruptions. Unlike SRAM-based FPGA alternatives, RTG4 FPGAs use programming techniques that provide low quiescent power consumption, which helps manage thermal issues common in spacecraft. RTG4 FPGAs consume a fraction of the total power of equivalent SRAM FPGAs while exhibiting zero configuration interruptions under radiation, eliminating the need for mitigation, reducing engineering and total system costs.
In addition, support for RTG4 FPGAs is provided by the Libero® SoC Design Suite, which provides a comprehensive suite of hardware tools, including RTL entry-to-programming, rich IP libraries, complete reference designs, and development kits. This enables developers to programmatically access RTL and includes a rich IP library, complete reference designs, and development kits.
