Micron has previously announced plans to increase its high-bandwidth memory market share from the current "mid-single-digit" to around 25% within a year. According to a report released by Nikkei, Micron will expand its production capacity in Taiwan, strengthen its R&D operations in the United States, and even consider producing HBM3E in Malaysia.
As a memory architecture designed for high-performance computing, HBM has become a key technology in the fields of artificial intelligence (AI), graphics processing, and high-performance computing due to its advantages of high bandwidth, low latency, and energy efficiency. With the rapid development of AI technology, there is an increasing demand for higher performance and lower power memory, and Micron's HBM3E technology meets this market demand.
In line with Micron's global expansion plans, the company is expanding HBM3E's production lines globally to ensure it can meet the growing market demand. Micron's plant in Taichung City, Taiwan, as the largest HBM memory production base, has been planned to increase production capacity to meet the global customer demand for HBM3E memory.
At the same time, at Micron's headquarters in Boise, Idaho, USA, the company is expanding its R&D and production facilities related to HBM. These facilities will include a technical validation line and a mass production line to ensure that Micron can continue to deliver market-leading HBM3E products. In addition, Micron is also planning to build HBM production capacity in Malaysia to further expand its global production network. The company is already testing and assembling commodity memory chips in Malaysia. Industry insiders say it's unlikely that Micron will produce real DRAM chips in Malaysia, as memory factories will take years to build and equip. But it is possible to test the HBM3E chip or even assemble the HBM3E in Malaysia.
Figure: Micron will expand HBM3E memory production globally
Micron's HBM3E technology offers significant advantages. Micron's HBM3E memory consumes less power and delivers better performance than its competitors. This advantage has made Micron's HBM3E memory very popular in the market and widely used in the products of AI computing chip giants such as NVIDIA. Nvidia expects to purchase about 48% of the world's HBM production capacity this year, further demonstrating the huge demand for high-performance memory.
Currently, Micron's production capacity in the HBM memory market is only about 3%, but the company has ambitious goals. Micron plans to increase its market share in HBM to approximately 20% by 2025, which is comparable to its overall revenue share in the dynamic random access memory (DRAM) industry. In order to achieve this goal, Micron not only needs to strengthen the construction of production capacity, but also needs to continuously promote technological innovation and product upgrades.
With the continuous evolution of AI technology and the growing demand for high-performance memory in data centers, Micron's market share in the HBM field is expected to further increase. Through global expansion plans and technological innovation, Micron is poised to become a leader in HBM, providing even better high-performance memory solutions to customers around the world. At the same time, it will lay a solid foundation for Micron's long-term development and add new impetus to its competitive position in the global semiconductor market.
