Mitsubishi Electric recently announced that it will invest 479 million yuan to build a new power semiconductor module packaging and testing (packaging and testing) plant at the power device manufacturing plant in Fukuoka City, Japan, which is scheduled to be completed and put into operation in October 2026. This project has become a high-profile event in the global power semiconductor industry, revealing the multiple dynamics of technological innovation, market demand and industry competition landscape.
1. Far-reaching strategic intent: to respond to the needs of the global market
With rapid growth in areas such as electric vehicles (EVs), renewable energy, and industrial automation, global demand for power semiconductors is at an all-time high. Power semiconductors are the key to improving the efficiency of power transmission, and their applications range from solar inverters and charging piles to industrial motors.
With this investment, Mitsubishi Electric aims to strengthen supply chain stability and strengthen its market position. IGBT (Insulated Gate Bipolar Transistor) and SiC (Silicon Carbide) technology have proven to be the main ways to improve energy efficiency and reduce losses as one of the core technologies of power semiconductors. The new facility not only ensures continuous supply, but also demonstrates the company's strong commitment to driving the global green energy transition.
Figure: Mitsubishi Electric spent 479 million yuan to build a power semiconductor module packaging and testing factory
2. From Decentralized to Centralized: A Model for Efficiency Upgrades
According to the plan, the new factory has a construction area of 25,270 square meters, and is dedicated to the centralized management of the entire process of power device packaging and testing. Mitsubishi Electric has been able to achieve significant efficiency improvements through the integration of the new Fukuoka site, which had previously had a fragmented production line.
The automated production line will introduce the latest intelligent technology, which runs through the whole process management from raw material receiving, manufacturing to product delivery. This integrated process not only reduces shipping time and costs, but also improves product consistency through a higher level of automation to meet demanding market demands.
For example, the high standards of soldering, thermal management, and structural design required in the packaging of power semiconductors will be further optimized with cutting-edge equipment in the new facility. This shift will significantly increase Mitsubishi Electric's packaging and testing capabilities, laying a solid foundation for Mitsubishi Electric to maintain its technological and cost advantages on a global scale.
3. Redefining the competitive landscape
After Mitsubishi Electric's new plant is put into operation, the global power semiconductor market may usher in a new round of reshuffle. Major competitors such as Infineon, Onsemi and ROHM are investing significantly in high-efficiency semiconductor technology. Mitsubishi Electric is expected to surpass the packaging and testing process through factory automation and scale effects, and further shorten the product delivery cycle.
It is worth noting that upstream materials such as silicon carbide (SiC) and gallium nitride (GaN) for power semiconductors have also become the focus of industry competition in terms of performance improvement. Mitsubishi Electric's strategic layout of the new plant shows that the company is not only focusing on the existing IGBT market, but also providing comprehensive support for the packaging and testing of next-generation SiC devices. This forward-looking planning will further strengthen its position in emerging markets.
4. A powerful booster for the green energy transition
The improvement in the performance of power semiconductors is directly related to the overall energy efficiency of power electronics. As one of the important driving forces of the global green transition, power semiconductors play a key role in improving energy efficiency.
Mitsubishi Electric said that the new Fukuoka plant will set a new benchmark for promoting the sustainable development of the industry by reducing energy consumption for packaging and testing, reducing waste and optimizing heat dissipation design on the basis of high-efficiency production. This green-oriented manufacturing model is not only in line with the global energy transition trend, but also has great significance for mitigating climate change.
5. Industry significance and future prospects
Behind this investment is not only Mitsubishi Electric's pursuit of technological leadership, but also its sense of responsibility as an industry leader. The power semiconductor industry is undergoing a technological upgrade from traditional silicon materials to wide bandgap semiconductor materials such as SiC and GaN. Mitsubishi Electric seized this historic opportunity by building a new plant.
The opening of the new plant is expected to lead to greater market competition, and Mitsubishi Electric will leverage its technology and production capabilities to provide better solutions for electric vehicles, industrial equipment, and energy conversion. In the long run, this investment will not only serve the company's internal needs, but also have the potential to drive technological innovation and green transformation of the power semiconductor industry in Japan and around the world.
6. Summary
Mitsubishi Electric invested 479 million yuan to build a Fukuoka power semiconductor module packaging and testing plant, revealing multiple trends in the development of the power semiconductor industry. From market demand to green transformation, from technological innovation to global competition, this event will become an important milestone in the development of the industry. In the future, with the completion and commissioning of the new plant, Mitsubishi Electric is expected to further consolidate its leading position in the world and make a greater contribution to the sustainable development of the power semiconductor industry.
