As technology continues to evolve, so does the need for smaller, more efficient computer chips. To address this need, a team of researchers from the University of Texas at Dallas (UTD), along with other universities and industry partners, is developing a novel indium-based material designed to advance the production of next-generation computer chips. This research project has received a $1.9 million grant from the National Science Foundation's (NSF) Future Semiconductor (FuSe2) program.
The FuSe2 program is a U.S. government grant program to achieve the goals of the CHIPS and Science Act to improve the energy efficiency of microchips in the United States and promote the production of local integrated circuits. The grant is part of a $42.4 million grant program to advance semiconductor manufacturing technology and energy efficiency.
Indium-based materials: the key to a breakthrough in EUV lithography
In this study, the scientists focused on developing novel indium-based materials that could be applied to extreme ultraviolet (EUV) lithography. Lithography is a crucial step in semiconductor manufacturing, involving the transfer of tiny circuit patterns onto the surface of silicon wafers, forming paths for components such as transistors. By upgrading lithography from traditional deep ultraviolet (DUV) light sources to extreme ultraviolet light sources, it is possible to achieve finer and miniaturized patterns on the chip, thereby improving the performance and energy efficiency of the chip.
However, the photon energy used in EUV technology is much higher than that of conventional ultraviolet light, reaching 92 electron volts, which conventional photoresists cannot withstand such high-energy illumination. As a result, researchers have designed novel indium-based photoresist materials that can work effectively in the EUV range, thereby improving the precision and efficiency of semiconductor manufacturing.
Provide new solutions for 3D chip manufacturing
In addition to making breakthroughs in EUV lithography, the research team is also exploring how to fabricate 3D integrated circuits. By stacking multiple layers of chips on top of each other, similar to the construction of high-rise buildings, 3D chips can further increase the computing power and storage density of chips. However, 3D chip manufacturing faces a major challenge – the existing circuit cannot be destroyed when building a new layer, so low-temperature materials need to be used so as not to destroy the underlying circuit during the heating process.
Professor Julia Hsu of the University of Texas at Dallas pointed out that when a new layer is added to an existing circuit, the circuit of the existing layer will be damaged if the heating temperature is too high. Indium-based materials can effectively solve this problem, ensuring that new layers can be stacked at low temperatures to avoid damage to existing circuits.
Figure: New indium-based materials drive breakthroughs in advanced chip manufacturing technologies (Source: semiconductordigest)
Photon curing technology: Improving manufacturing efficiency
To solve the problems in traditional methods, Professor Xu is testing an innovative technology – photon curing. Photon curing uses high-intensity but low-energy pulses of light to trigger chemical reactions that help indium oxides achieve better semiconductor properties without heating existing circuits. This approach simplifies the chip manufacturing process and increases production efficiency.
Interdisciplinary collaboration and industry support
The research brought together experts in the field, including Professor Cormac Toher to design the indium-based molecule and Professor Kevin Brenner to fabricate and test the device. In addition, the research team collaborated with Professor Howard Katz of Johns Hopkins University on the synthesis of indium-based molecules, EUV testing with Professor Chih-Hao Chang of the University of Texas at Austin, and with companies and institutions such as Tokyo Electron, Koping State University, and Northrop Grumman.
More than just an academic research program, the program includes semiconductor industry workforce training, training community college students through the North Texas Semiconductor Research Institute, and developing professionals for the semiconductor industry of the future.
Looking to the future
By introducing indium-based materials, the research team aims to advance semiconductor technology that will enable chips to be smaller and more efficient, while also better meeting the computing power and energy efficiency needs of future electronics. This research not only brings new breakthroughs to the semiconductor industry, but also supports the United States to stay ahead of the global technology competition, while helping to advance energy efficiency and sustainability goals.
