To meet the requirements of next-generation semiconductor devices, chipmakers are developing processes that use new materials and operate at lower or higher temperatures and different pressure conditions.
These trends have created new challenges for equipment in secondary plants, particularly vacuum pumps and gas abatement systems, which need to handle new materials and their process by-products at higher volumes as demand continues to increase. "The range of easily condensing CVD (chemical meteorological deposition) precursor materials and reaction by-products in process chamber vacuum systems is expanding," said Neil Garland, Vice President of Marketing for Dry Pumps at Edwards.
The application of a system-level approach is critical in the design and management of a SubFab. This approach allows for optimal performance and reliability by integrating control interactions. For example, both semiconductor manufacturers and flat panel display manufacturers face complex pattern layer construction and alignment issues for composite structures. System-level design and control not only optimizes performance, but also helps manufacturers respond intelligently and effectively to changes in government regulations that control process emissions.
Industry 4.0 technologies, also known as smart manufacturing, have been widely used in the semiconductor industry. Although implementation at the SubFab is still in its early stages, some initial efforts are already underway. For example, generating emissions reports by monitoring and overlaying gas flow and abatement availability, as well as alarm management for SubFab components. The application of these technologies can not only improve production efficiency, but also help manufacturers better manage resources and reduce emissions.
Figure: New semiconductor processes bring new challenges to sub-fabs
New processes and materials can produce large amounts of wastewater by-products that are difficult to treat. For example, high aspect ratio processes (HARP) and "dirty" chemical reactions can clog front lines, gate valves, and pumps. To address these challenges, Applied Materials is developing Aeris-S abatement technology to reduce contamination by converting problematic materials into compounds that are easier to manage and transport.
As more and more sensors are integrated into devices and networks, real-time energy balancing and the use of data mining engines will become possible. Deep learning algorithms will be used to predict and predict maintenance events. The application of these technologies can not only improve the operational efficiency of the equipment, but also reduce maintenance costs and time.
With the global emphasis on environmental protection and sustainable development, customers are increasingly demanding sustainability in semiconductor manufacturing processes. As an important part of semiconductor manufacturing, sub-fabs need to take responsibility for reducing environmental impact and improving resource utilization. The introduction of new processes is often accompanied by the use of new materials and the generation of by-products, which requires Sub-Fab to take more environmentally friendly and sustainable measures in terms of material selection, process optimization, and waste disposal. For example, we will reduce our impact on the environment by introducing green energy, implementing water recycling, and reducing the emission of harmful substances. At the same time, we will strengthen communication and cooperation with suppliers and customers to jointly promote the sustainable development of the semiconductor industry.
