According to reports, the U.S. Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced that the intended location of the first "American Chip" research and development (R&D) flagship facility has been determined. The NSTC facility, known as the U.S. Chip extreme ultraviolet (EUV) accelerator, is expected to operate within the NY-CREATES Albany nanotechnology complex in Albany, N.Y., and is expected to receive about $825 million in federal investment. The EUV Accelerator will focus on advancing state-of-the-art EUV technology and related R&D.
As an important part of President Biden's "Invest in America" agenda, the "American Chips" program aims to strengthen the U.S. semiconductor supply chain, accelerate leading-edge research and development, and create quality jobs. The facility will bring together NSTC members from across the ecosystem to accelerate semiconductor R&D and innovation, providing the necessary technologies, capabilities, and resources.
"Through this first-of-its-kind proposed flagship facility, Chip America will provide cutting-edge research and tools to the NSTC, and its launch marks an important milestone in ensuring that the U.S. remains a global leader in innovation and semiconductor R&D," said Commerce Secretary Gina Raimondo. "The R&D portion of the 'Chips America' and Science Act is critical to our national security and ensuring America's leadership in the technology race. Thanks to President Biden and Vice President Harris, we are not only producing the world's most advanced semiconductors, but we are building a resilient ecosystem that will drive technologies ranging from smartphones to advanced AI to safeguard America's national security and keep the United States competitive for decades to come. ”
"This $825 million investment by the Biden-Harris administration will cement Albany as a leading semiconductor innovation and R&D hub for entrepreneurs, researchers and engineers around the world," said Lyle Brainard, national economic advisor.
EUV lithography is essential for making smaller, faster, and more efficient microchips. As the semiconductor industry pushes the limits of Moore's Law, EUV lithography has become a key technology to enable mass production of transistors in excess of 7 nanometers. As NSTC grows, access to EUV lithography R&D is critical to achieving its three main goals: 1) to continue U.S. technology leadership; 2) shorten the time and cost of prototyping; 3) Build and maintain a semiconductor talent ecosystem.
Picture: U.S. NSTC Program (Source: NY Creates)
"With nearly 20 years of success in fostering effective public-private partnerships and more than $25 billion invested in semiconductor R&D, manufacturing, and talent development since its inception, NYCREATES is well-positioned to support NSTC's mission to provide an open environment for accelerating research, reducing time to commercialization, and developing a sustainable semiconductor ecosystem," said Laurie Lokaschio, vice minister of standards and technology at the department of commerce and director of the national institute of standards and technology.
"The 'Chip America' EUVA accelerator underscores our commitment to developing and advancing next-generation semiconductor technologies in the United States," said Deird Hanford, CEO of Natcast. "Through our partnership with NY CREATES, Natcast and NSTC members will have access to vital EUV lithography tools and processes that will drive broader research and accelerate the commercialization of tomorrow's technologies."
Natcast and NY CREATES, a non-profit organization that drives semiconductor R&D and talent development, plan to establish an EUV accelerator for NSTC members for next-generation semiconductor research and development. The EUV accelerator is expected to begin operations in early 2025, enabling Natcast, NY CREATES, and NSTC members to collaborate on R&D activities critical to accelerating the commercialization of innovative semiconductor technologies. Key features of the EUV accelerator include:
- Offering state-of-the-art EUV lithography tools and next-generation R&D capabilities, including high numerical aperture (NA) EUV systems, with standard NA EUVs expected to be operational in 2025 and high NA EUVs expected to be launched in 2026.
- Foster collaboration with industry, academia, and government partners to accelerate technological innovation.
- Establish a dedicated NSTC office in the field to support the research efforts of Natcast and NSTC members.
- Support projects for the training and development of high-quality personnel.
- Strive to expand NSTC membership and participation while fostering an open, collaborative R&D environment that serves all NSTC facilities.
The "Chip America" NSTC prototype and the National Advanced Packaging Manufacturing Program (NAPMP) advanced packaging pilot facility, as well as the "Chip America" management and design facility, are still in preparation. The Department of Commerce and Natcast expect to release information on the selection of affiliated technology centers in the coming months.
