On March 18, 2025, onsemi introduced the first generation of SPM 31 intelligent power modules (IPMs) based on 1200V silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs). The onsemi EliteSiC SPM 31 smart power module delivers the highest energy efficiency and power density in the smallest form factor compared to products with Field Stop 7 insulated gate bipolar transistor (IGBT) technology, resulting in a lower total system cost than any other mainstream solution on the market. The module's improved thermal performance, lower power losses, and ability to support fast switching speeds make it ideal for three-phase inverter drive applications such as electronically commutated (EC) fans, heat pumps, commercial HVAC systems, servo motors, robots, variable frequency drives (VFDs), and industrial pumps and fans in AI data centers.
The EliteSiC SPM 31 smart power module offers a wide range of current ratings from 40A to 70A. Combined with onsemi's IGBT SPM 31 smart power module portfolio, which covers the low current range from 15A to 35A, onsemi now offers the industry's broadest, scalable and flexible integrated power module solutions in a small package.
In 2023, U.S. residential and commercial buildings accounted for 27.6% of final energy consumption from operations. With the advancement of electrification and the widespread application of AI technology, especially the construction of more AI data centers, the energy demand continues to increase, and reducing the energy consumption of applications in this field has become more and more critical. Power semiconductors, which can efficiently convert electrical energy, are key to the transition to a low-carbon world.
As the number and scale of data centers increases, the demand for EC fans is expected to continue to rise. These cooling fans maintain an ideal operating environment for all equipment in the data center and are essential for accurate data transmission. SiC intelligent power modules ensure reliable operation of EC fans and maintain maximum efficiency.
Figure: Onsemi launches silicon carbide-based intelligent power module (Source: onsemi)
Like many other industrial applications, such as compressor drives and pumps, EC fans require higher power density and efficiency than existing large IGBT solutions. Customers who choose the EliteSiC SPM 31 smart power module benefit from a smaller footprint, higher performance, and simplified design due to a high degree of integration, resulting in shorter development time, lower total system cost, and reduced greenhouse gas emissions. For example, with the highly efficient EliteSiC SPM 31 intelligent power module, the energy consumption and cost per EC fan per year can be reduced by 52% compared to a system solution using the current IGBT Power Integrated Module (PIM) with a power loss of 500W at 70% load.
The fully integrated EliteSiC SPM 31 intelligent power module consists of a separate high-side gate driver, low-voltage integrated circuit (LVIC), six EliteSiC MOSFETs, and a temperature sensor (voltage temperature sensor (VTS) or thermistor). The module is based on industry-leading M3 silicon carbide technology, which reduces chip size and is optimized for hard-switching applications. When applied to the SPM 31 package, its short-circuit withstand time (SCWT) performance is improved, making it suitable for industrial inverter motor drives. The MOSFETs feature a three-phase bridge configuration with separate source connections on the lower arm, providing maximum flexibility in the selection of control algorithms.
In addition, the EliteSiC SPM 31 intelligent power module offers the following benefits:
- Low-loss, short-circuit-rated M3 EliteSiC MOSFETs protect devices and components from catastrophic failures such as electric shock and fire.
- Built-in under-voltage protection (UVP) to protect the device from damage when the voltage is too low.
- As an equivalent to the FS7 IGBT SPM 31, customers can choose from a wide range of current ratings while using the same printed circuit board (PCB).
- UL certified to meet national and international safety standards.
- Single-ground power supply for added safety, better protection of equipment and reduced noise.
- Simplifies the design and size of customer boards due to integrated gate driver control and protection, built-in bootstrap diodes (BSDs) and resistors (BSRs), internal boost diodes for high-end gate boost drives, integrated temperature sensors (VTS and/or thermistors output by LVIC), and built-in high-speed high-voltage integrated circuits.
