In 2024, it can be said that all industries in China are very involuted, including the component industry, and going global has become the consensus of all walks of life. With the performance of China's components gradually keeping up with the world's first-class level, and the consistency and reliability of products gradually being recognized by golobal markets, the time for Chinese components to go global has become more and more mature.
According to incomplete statistics, in the first half of 2024, China's total exports of integrated circuits have reached 542.7 billion yuan, an increase of 25% over the same period last year, as long as this growth rate continues in the second half of the year, it is expected that by the end of 2024, China's chip exports may exceed 1 trillion yuan. A large part of this should be passive components, because the technical threshold of this industry is relatively low, and the gap between Chinese manufacturers and world-class suppliers is also the smallest.
However, due to the differences in culture and laws and regulations in various countries around the world, the internationalization of China's passive component industry is not all smooth sailing, and it must also overcome various new business challenges. For example, how to quickly prove the company's qualifications, strength and business reputation to overseas customers? How to judge the business reputation of an global company? How to quickly gain the trust of overseas banks, customs, logistics and other enterprises or institutions? How to quickly acquire customers in different overseas countries? How to avoid tax or non-compliance risks in different countries? And so on, especially for enterprises that are planning to go abroad, they should learn from their predecessors, only in this way can we ensure that there are fewer detours, avoid pitfalls, and ensure that every step is steady and solid.
In order to help Chinese component manufacturers and their distribution agents go faster and more stable in global markets, Shenzhen Electronic Chamber of Commerce and Shenzhen YeeHai Global company, which has been committed to global marketing services, will host the [2024 International Component Industry Chain Overseas Expansion Forum] on November 8, 2024 (Friday) in Hall 13 of Shenzhen World Convention and Exhibition Center. Executives from the National Integrated Circuit Trading Center, Silergy Corp., TG Testing Technology, Time-Varying Transmission, Shenzhen Council for the Promotion of International Trade, YeeHai Global and other enterprises shared their unique insights and lessons learned. We look forward to building a bridge for participants through this forum, so that everyone can learn from each other, inspire each other, and walk hand in hand.
Highlights of the Forum's Agenda:
- 09:00-09:50: Guest sign-in and networking opportunities for attendees.
- 09:50-09:55: Opening speech by Mr. Xinghua Zhao, a well-known semiconductor expert and investor.
- 09:55-10:00: Opening speech by Ms. Xu Huiying, Secretary General of Shenzhen Electronic Chamber of Commerce.
- 10:00-10:20:"From Design to Procurement, Xinyao Plans to Help Local Chips Go Overseas", shared by Mr. Yuan Wenbin, SaaS Pre-Sales Manager of Supplyframe.
- 10:20-10:40: "Southeast Asia Electronic Components Market Development Strategy", delivered by Mr. Wu Zhengzhen, co-founder of ZhengXinhui.
- 10:40-11:00: "Brand Expansion Strategy in Overseas Markets", explained by Mr. Wang Zhilong, General Manager of YeeHai Global.
- 11:00-11:20: "The Rise of RISC-V Ecology and the Prospect of Going Overseas Markets", discussed by Mr. Xu Chaobing, Assistant to the Chairman of Silergy Corp.
- 11:20-11:40: "Prospect of Beidou and Other Wireless Modules Going Overseas", analyzed by Mr. Zhou Dapeng, CTO of TG Testing Technology.
- 11:40-12:00: "Sharing on the Market Strategy of Semiconductors Going Overseas in the Middle East, Europe and the United States", introduced by Mr. Fan Guanghui, Vice President of Time-Varying Transmission.
In addition, the forum also included a VIP networking luncheon to provide participants with more in-depth communication and cooperation opportunities.
How to Register:
Please scan the QR code below to register for this forum and discuss the way of the semiconductor industry to go overseas with industry leaders.
Figure: 2024 International Component Industry Chain Overseas Expansion Forum registration QR code
Organizer: Shenzhen Electronic Chamber of Commerce
Organizer: YeeHai Global (Shenzhen) Co., Ltd
Co-organizers: Shenzhen Intelligent Terminal Industry Association, Huayou Association, Kunpeng Commune
Supporters: China Exportsemi, XTL Resource Sharing Platform
China Exportsemi looks forward to your participation and jointly start a new journey of globalization of the semiconductor industry chain!
When: November 8, 2024
Venue: Hall 13, Shenzhen World Convention and Exhibition Center, · City, China
Please scan the QR code to register for the event.
Figure: Invitation letter of the 2024 International Component Industry Chain Overseas Expansion Forum
