Renesas Electronics Corporation today announced the industry's first complete memory interface chipset solution for second-generation DDR5 multi-capacity row dual in-line memory modules (MRDIMMs). With the rapid growth of memory bandwidth requirements for artificial intelligence, high-performance computing, and data center applications, DDR5 MRDIMMs technology has emerged. The new generation of MRDIMMs supports transfer speeds of up to 12,800 MT/s (Mega Transfers Per Second), which provides a 35% increase in memory bandwidth compared to the previous generation. This breakthrough makes it ideal for high-performance computing platforms, which can effectively alleviate memory bandwidth bottlenecks.
Industry-leading complete chipset solutions
Renesas has played a central role in the design, development, and mass production of DDR5 MRDIMMs through years of technology and close partnerships with CPU and memory vendors, as well as key end customers. The chipset released this time includes three new key components:
1. 2nd Generation Multiplexed Register Clock Driver (MRCD, Model RRG50120)
1. As one of the core components of MRDIMMs, RRG50120 buffers and distributes the command/address (CA) bus, chip selection signals, and clock signals between the master and the DRAM.
2. With 45% lower power consumption than the first-generation MRCD, the thermal performance of the system is greatly optimized, making it ideal for ultra-fast and high-density server applications.
3. Supports data rates up to 12.8 GB/s to ensure signal integrity and stability at high speeds.
2. 2nd Generation Multiplexed Data Buffer (MDB, Model RRG51020)
1. This component is used to buffer the data path from the CPU to the DRAM and is a key device to achieve the high bandwidth performance of MRDIMMs.
2. RRG51020 Uses advanced signal processing to dramatically reduce latency and optimize data throughput for future demand for higher data rates.
3. Through the optimized design of the data path, the component achieves high-performance transmission in high-bandwidth environments.
3. Second-generation power management integrated circuits (PMICs, model RRG53220)
1. The PMIC is the power management core of the memory module, RRG53220 provides industry-leading electrical overstress protection (EOS) and efficient power conversion capabilities.
2. It supports high-current and low-voltage operation, optimizes power distribution, helps reduce overall energy consumption, and improves system reliability.
3. Advanced voltage regulation technology ensures stable power supply under dynamic load changes.
Figure:Renesas Introduces Industry's First Complete Memory Interface Chipset Solutions
In addition, Renesas offers temperature sensor (TS) and serial presence sensing hub (SPD Hub) solutions in production, making it the only supplier to offer a full suite of memory interface chipsets for the next generation of standardized MRDIMMs and other DIMMs, including servers and clients.
Advancing technology in high-performance computing
As AI and HPC applications increasingly demand data processing power, the performance of the memory subsystem becomes key to the overall efficiency of the system. The birth and upgrade of MRDIMMs is the core path to solve the memory bottleneck, and Renesas provides comprehensive technical support to the industry through the innovative design of three components:
1. Power Optimization and Thermal Control RRG50120 MRCD's power consumption is significantly reduced, enabling memory modules to operate stably in extreme environments while reducing cooling costs.
2. High-bandwidth and low-latency RRG51020 MDBs enable next-generation data centers by improving data buffer structures and signal paths to achieve lower latency and higher throughput.
3. Efficient power management RRG53220 the low power consumption and high performant characteristics of PMICs ensure stable and reliable power support in high-load applications of memory modules, extending the life of the modules.
Market outlook and strategic significance
Davin Lee, Senior Vice President and General Manager, Analog & Connectivity & Embedded Processing Business Unit at Renesas, emphasized, "Renesas has been at the forefront of technological innovation in the face of the need for AI and HPC-driven high performance. Together with industry partners, we are developing next-generation memory interface technologies to help customers meet growing market demands with complete chipset solutions.”
In the future, Renesas will continue to focus on optimizing MRDIMMs technology to provide more efficient memory solutions for data center, AI, and HPC applications, consolidating its leadership position in the memory interface market, and promoting technology upgrades and ecosystem improvements throughout the industry.
