Samsung Electro-Mechanics (SEMCO) announced that it has partnered with AMD to create high-performance substrates for hyperscale data center computing applications. These innovative substrates will be produced by SEMCO's cutting-edge technology R&D center in Busan, Korea, and a new high-tech factory in Viet Nam, ensuring excellent product quality and sufficient production capacity.
According to Prismark, an authoritative research institute in the market, the semiconductor substrate market will continue to grow, and the market size is expected to expand from 15.2 trillion won in 2024 to 20 trillion won by 2028, with an average annual growth rate of about 7%. Against this backdrop, SEMCO's investment of KRW 1.9 trillion in the FCBGA (Flip Chip Ball Grid Array) plant demonstrates SEMCO's firm determination to deepen its substrate technology research and development and enhance its manufacturing capabilities to meet the industry's highest standards and future technology needs.
The collaboration between SEMCO and AMD is focused on solving the technical challenges of efficiently integrating multiple semiconductor chips (chiplets) on a single large substrate. These high-performance substrates are critical to core computing components such as CPUs and GPUs, enabling the complex and dense interconnection needs of data centers by providing more surface area and more layers. Compared with traditional computer substrates, the area of the substrate for data centers has been expanded by ten times, and the number of layers has been increased by three times, ensuring the high efficiency of power transmission and the lossless transmission of signals between chips. SEMCO's unique and innovative manufacturing process effectively addresses challenges such as substrate warpage, ensuring a high yield during chip mounting.
Pictured: Samsung Electro-Mechanics and AMD have entered into a partnership
SEMCO's FCBGA facility is equipped with an advanced real-time data collection and analysis system, as well as sophisticated modeling techniques that enable the company to develop accurate predictive manufacturing models that fully guarantee the integrity of the substrate's signal, power, and mechanical structure. This world-class facility reinforces SEMCO's leadership in embedded substrates, which integrate passive components such as capacitors and inductors and active components such as integrated circuits to address the urgent need for forward-looking technologies in next-generation data centers.
Kim Wontaek, Executive Vice President of Strategic Marketing Center at Samsung Electro-Mechanics, said, "We are honored to enter into a strategic partnership with a global leader in high-performance computing and AI semiconductor solutions like AMD. Our continued investment in advanced substrate solutions is designed to provide core value to our customers, including AMD, as they address the evolving needs of compute-intensive applications such as data centers and AI and automotive systems. Scott Aylor, vice president of manufacturing strategy for AMD's global operations, added, "AMD is committed to pushing the boundaries of innovation to meet our customers' demands for performance and efficiency. "Our leadership in chiplet technology enables us to deliver superior performance, efficiency and flexibility across our CPU and data center GPU portfolios." "Our continued collaboration with partners such as SEMCO is part of our efforts to ensure that we have the advanced substrate technology and capacity needed for future generations of high-performance computing and AI products."
