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Samsung Provides a One-stop Service for Integrated Storage, Foundry and Packaging

According to reports, Samsung said at the "Annual Foundry Forum" held in California, USA, that it plans to integrate its memory chips, foundry and chip packaging services to provide customers with one-stop solutions to manufacture AI chips faster and ride the AI frenzy.

Samsung Electronics' one-stop service not only simplifies the customer's operation process, but also achieves a major breakthrough at the technical level. By employing Power-over-Back (BSPDN) and Gate-Around-the-Loop (GAA) transistor technologies, Samsung has achieved significant performance gains and power reductions at the 2nm process node, which are expected to reach mass production in 2027.

In addition, Samsung Electronics has announced two new process nodes, SF2Z and SF4U, to further strengthen its cutting-edge process technology roadmap. The SF2Z process uses optimized backside power delivery network technology, while SF4U is a high-value 4nm variant, and the introduction of both will provide more possibilities for the design and manufacture of AI chips.

Samsung also highlighted the advantages of its one-stop service:

Time efficiency improvement: Customers do not need to communicate and collaborate with multiple enterprises, and only need to connect with Samsung to complete the whole process of production. This not only reduces communication costs, but also significantly shortens the production cycle and improves time efficiency.

Process simplification: The one-stop service simplifies the supply chain management and production process, reducing the customer's operating costs and risks. Customers can focus more on their core business and improve their market competitiveness.

Technological innovation: Samsung has strong technical strength and innovation capabilities in the semiconductor field, and through one-stop service, customers can enjoy the latest technology and solutions to improve the technical level and market competitiveness of products.

Samsung provides a one-stop service

Pictured: Samsung provides a one-stop service

Samsung's one-stop service covers the entire process from memory chips to contract manufacturing to packaging and testing. This means that customers only need to connect with Samsung to get a complete semiconductor solution, which greatly simplifies the supply chain management and packaging process.

Samsung Electronics is optimistic about the future development of the global chip industry. It is estimated that by 2028, the promotion of AI chips will increase the revenue of the global chip industry to $778 billion. This forecast reflects the widespread application of AI technology in various fields and the urgent need for high-performance computing chips.

With the advent of the age of artificial intelligence, structural improvements such as ring gates (GAAs) have become necessary to meet power and performance requirements. Samsung highlighted the maturity of its GAA technology as a key technology enabler for AI.

Entering its third year of mass production, Samsung's GAA process continues to demonstrate continued maturity in terms of yield and performance. With its accumulated GAA production experience, Samsung plans to mass-produce its second-generation 3nm process (SF3) in the second half of this year and achieve GAA on the upcoming 2nm process.  Samsung's GAA production has been growing steadily since 2022 and is poised to expand significantly in the coming years.

In addition, Samsung will also actively explore new markets and application areas, launch more innovative and competitive products and services, and provide better and more efficient semiconductor solutions to customers around the world.

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