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Samsung Unveils Chip Technology Roadmap Aming beyond Nanometer Limits for AI

On June 13, Samsung Electronics unveiled its chip technology roadmap at the "2024 Samsung Foundry Forum", a strategic layout that marks Samsung's ambition in the global AI chip field. Samsung expects its AI-related customer list to grow fivefold and revenue ninefold by 2028. This forecast not only demonstrates Samsung's optimism about the AI chip market, but also reflects its far-reaching plans in the field of semiconductor technology.

Advanced technology: backside power supply network technology

Samsung's advanced process technologies, particularly Backside Power Delivery Network (BSPDN) technology, which place the power rails on the back of the silicon wafer, are an innovative design that is expected to significantly improve the power consumption, performance, and voltage of the chip. Samsung's GAA (Total Surround Gate) architecture is seen as a key factor in continuing to make more powerful chips for AI compared to traditional FinFET technology.

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Pictured: Samsung unveils its chip technology roadmap

One-stop-shop: Consolidate storage, foundry, and packaging

Samsung plans to provide customers with a one-stop shop that integrates its world-leading memory chips, wafer fabrication and chip packaging services. This integrated service is expected to reduce the time from R&D to production by 20 percent. Through this one-stop service, Samsung will not only be able to speed up the production of AI chips, but also be able to meet customer needs more efficiently, thereby gaining an advantage in the fierce market competition.

GAA processors: Samsung's AI chip strategy

Samsung's AI-based GAA processor is an important part of its technology roadmap. Samsung plans to mass-produce the second-generation 3nm GAA process in the second half of this year and offer GAA technology in the upcoming 2nm process. In addition, Samsung's 1.4nm process is also progressing smoothly, and mass production is expected to be achieved in 2027.

Market competition and future prospects

TSMC, Samsung's main competitor in the chip foundry space, currently occupies a leading position in the market. However, Samsung is working hard to narrow the gap with TSMC and seek breakthroughs in the field of AI chips through continuous technological innovation and strategic layout. Samsung believes that with the rapid development of AI technology, the demand for high-performance, low-power AI chips will continue to grow, which will bring huge market opportunities to Samsung.

In general, Samsung's chip technology roadmap not only demonstrates its technical strength and market confidence in the field of AI chips, but also reflects its deep insight into the future development of the semiconductor industry. With the continuous advancement of AI technology and the expansion of application fields, Samsung is expected to play a more important role in the global AI chip market. However, in the face of fierce market competition and an ever-changing technology environment, Samsung needs to continue to innovate and optimize its products and services to achieve its ambitious vision.


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