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Samsung Unveils Wearable Device Chip

Recently, Samsung released its first 3nm wearable device chip, the Exynos W1000, in a FOPLP package.

The Exynos W1000 is powered by Samsung's state-of-the-art 3nm GAA (Gate-All-Around) process, a breakthrough that means the chip can carry higher levels of integration and performance while maintaining a very small size. Compared to previous process nodes, 3nm GAA technology brings significant energy efficiency improvements, bringing longer battery life and faster operation speed to wearable devices.

In terms of performance, the Exynos W1000 has made a quantum leap. It features an all-new CPU architecture, including a high-performance Cortex-A78 core and four high-efficiency Cortex-A55 cores, making the chip more capable of handling complex tasks. According to Samsung's official introduction, the performance of the Exynos W1000 in single-core and multi-core benchmarks is improved by 340% and 370% respectively compared to its predecessor, which means that users will be able to launch apps faster than ever before and seamlessly switch between multiple tasks to enjoy a smooth and frictionless operation experience.

In addition to its powerful performance, the Exynos W1000 also excels in terms of display. It is equipped with an Arm Mali-G68 MP2 GPU, which is capable of supporting qHD (960x540) and screen displays up to 640x640 resolution, bringing users a detailed and clear visual experience. At the same time, the 2.5D continuous display (AOD) engine built into the chip makes the dial design of the smart watch more colorful, making every hand raise a visual feast.

Figure: Samsung released its first 3nm wearable device chip, Exynos W1000 (Source: C114 Communication Network)

When it comes to connectivity, the Exynos W1000 also excels. It integrates Samsung's LTE Cat.4 modem and supports a maximum downlink rate of 150Mbps and a maximum uplink rate of 75Mbps, allowing users to maintain a stable network connection no matter where they are. In addition, the chip also supports a variety of global navigation satellite systems (GNSS) such as GPS, GLONASS, Beidou, and Galileo, as well as Bluetooth LE audio, Wi-Fi b/g/n, NFC and other connection methods, making smart wearable devices more convenient and efficient in data transmission, location positioning and wireless communication.

To achieve a smaller size and better heat dissipation, the Exynos W1000 features Fan-Out Panel-Level Package (FOPLP) technology. This advanced packaging technology not only improves the integration and reliability of the chip, but also makes the entire chip module more compact and thin. At the same time, the chip also uses a system-in-package (SiP) method to integrate the power management IC (PMIC) in the SIP-ePoP package, and mounts DRAM and NAND flash memory through the embedded package (ePoP), which further improves the performance and stability of the entire system.

Samsung said that the Exynos W1000 is expected to be first installed in the upcoming Galaxy Watch 7 smartwatch, which will not only bring users a superior performance experience, but also redefine the performance and charging frequency expectations of smart watches.

With the release of the Exynos W1000, Samsung's competitiveness in the wearables segment has been further strengthened, while also setting a new performance benchmark for the entire industry. The launch of this chip will undoubtedly promote the development of the wearable device market in the direction of higher performance and better experience.

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