With the increasing complexity of electronic device functions, traditional monolithic integrated circuit (SoC) designs face both integration and cost challenges. Chiplet technology provides new ideas to solve these challenges by designing multiple functional blocks (e.g., CPU, GPU, memory, etc.) as independent Chiplets and then integrating them together through advanced packaging technologies.
SEMIFIVE, a pioneer in platform-based custom silicon solutions and a leading design solutions provider, has been on their journey with OPENEDGES Technology Inc., a provider of comprehensive memory subsystem IP, since 2019. The two companies' history of collaboration can be traced back to co-delivering multiple different SoC platforms for a variety of use cases, including AI inference, IoT SoCs, and high-performance computing.
At the heart of this collaboration is the development of an advanced chip-granularity platform that integrates the OPENEDGES LPDDR6 memory subsystem. The platform is specifically optimized for the 4nm process node and includes a DDR memory controller and DDR, PHY, IP, which are provided by OPENEDGES and have been silicon-proven to significantly improve performance, efficiency, and dram utilization.
SEMIFIVE will leverage its expertise in SoC design and package development, combined with OPENEDGES' memory subsystem IP, to create an HPC SoC chip-granularity platform that sets new standards in the industry. The development of this platform will not only accelerate the pace of innovation in the semiconductor industry, but will also meet the needs of different customers, creating opportunities for new business models and collaboration across ecosystems.
PICTURED: SEMIFIVE PARTNERS WITH OPENEDGES TO DRIVE CORE DEVELOPMENT
SEMIFIVE's chip granularity platform heralds a new paradigm in semiconductor design and manufacturing, promising to have a significant impact on the market by reducing costs, optimizing performance, and developing flexibility. As this technology evolves, it is expected to bring accelerated innovation to the semiconductor industry, meet the diverse needs of customers, and provide more opportunities for collaboration within new business models and ecosystems.
SEMIFIVE is a pioneer in platform-based SoC design and is committed to helping customers turn innovative ideas into custom silicon solutions in the most efficient way. Their SoC platform provides a powerful starting point for new chip designs, leveraging configurable domain-specific architectures and a pre-validated pool of critical IP. SEMIFIVE provides comprehensive specification-to-system capabilities, end-to-end solutions for faster, lower-cost, and less risky implementation of custom SoCs for critical applications, such as data centers or AI-enabled IoT.
OPENEDGES Technology, Inc. is a top provider of memory subsystem IP for the semiconductor industry. They offer a range of cutting-edge solutions including DDR memory controllers, DDR PHYs, NoC interconnects, and NPU IP, which are widely adopted by customers around the world. Their IP is JEDEC compliant, including LPDDR5X/5/4X/4/3, DDR5/4/3, GDDR6, and HBM3, ensuring compatibility with the latest DDR technology trends.
As this strategic partnership advances, SEMIFIVE and OPENEDGES will continue to play a leading role in the semiconductor industry, driving technological advancements, meeting market needs, and providing more efficient and innovative solutions to customers around the world.
