In recent years, semiconductor technology and thermal management solutions have played an increasingly important role in several industries with the rapid development of electric vehicles (EVs) and efficient power infrastructure. Especially in the fields of power semiconductors and thermoelectric coolers, continuous technological innovation is driving the miniaturization and performance improvement of equipment. Recently, Advantest and Tsinghua University have made important breakthroughs in semiconductor testing and thermoelectric refrigeration technology, respectively, bringing new impetus to the future development of the industry.
Advantest is pushing the boundaries to optimize power semiconductor testing
In the field of semiconductors, the testing of power semiconductors, especially wide bandgap (WBG) devices, has always been a technical challenge, especially for devices such as silicon carbide (SiC) and gallium nitride (GaN), whose high voltage and high current characteristics make the testing process complex and easy to damage equipment. To address this issue, Advantest Corporation has launched a new integrated test cell designed to improve the yield of chip-level testing of WBG devices.
The unit combines the CREA MT series power device tester with the new HA1100 chip detector to effectively eliminate the risk of equipment damage through innovative Probe Card Interface (PCI) technology. Advantest's test cells also quickly diagnose problems in the event of equipment damage during testing, reducing downtime and keeping the production line running efficiently. This solution will help customers significantly reduce manufacturing costs and improve the yield of their final products, especially in the fields of electric vehicles and power infrastructure, where the demand for power semiconductors grows.
Figure: Technological innovation is driving miniaturization and efficiency in the semiconductor and thermoelectric cooler industries
Tsinghua University's technological breakthrough has opened up a new path for the miniaturization of thermoelectric coolers
Another area related to semiconductor technology, thermoelectric refrigeration, has also ushered in important innovations. The team of Professor Li Jingfeng of Tsinghua University recently proposed a new microstructure modulation strategy, which significantly improves the mechanical strength and thermoelectric properties of bismuth telluride (Bi2Te3) alloy, and provides a new solution for the miniaturization and efficiency of Peltier coolers (PC).
Peltier cooler is a chip-level refrigeration device based on the thermoelectric effect, which is widely used in thermal management of electronic equipment. Although bismuth telluride alloys perform well in chillers, the mechanical properties of their layered structure are weak, which limits their further miniaturization. Prof. Li's team promoted the densification of the alloy through annealing and hot forging processes, and added SiC nanoparticles to achieve dispersion strengthening, which not only improved the mechanical properties, but also effectively improved the thermoelectric properties. More importantly, they succeeded in optimizing the thermoelectric efficiency of the alloy through component modulation, driving the miniaturization and precision machining of this technology.
This breakthrough means that future thermoelectric coolers will be able to provide efficient heat dissipation in more compact spaces, which is a huge boon for thermal management systems in smart devices, consumer electronics, and even the automotive industry.
Technology integration to promote industrial progress
The two technological breakthroughs – Advantest's innovation in power semiconductor testing and Tsinghua University's progress in the field of thermoelectric coolers – not only reflect the technological frontiers of their respective fields, but also epitome the overall technological innovation. With the rapid development of electric vehicles, smart devices, and high-performance computing, the convergence of semiconductor and thermal management technologies will become even closer. These technologies will not only help improve the efficiency and reliability of products, but will also drive more compact and efficient product designs.
For example, future electric vehicles may feature more efficient power semiconductor modules that use Advantest's test cells to improve yield and ensure long-term product stability. At the same time, on-board electronic systems equipped with new thermoelectric coolers will be able to better manage thermal properties, improving the overall efficiency and service life of the system.
Conclusion
The progress of semiconductor and thermoelectric refrigeration technology is not only a breakthrough in a single field, but also the result of collaborative innovation of multiple technologies. As these technologies mature and become widely available, the electronics of the future will be more efficient, compact and intelligent. These innovations not only bring new opportunities to related industries, but also provide a strong impetus for global scientific and technological progress. With the development of technology, the semiconductor and thermal management technology market will usher in a broader prospect in the next few years.
