With the acceleration of the commercialization of the fifth generation of mobile communication technology (5G), the requirements for packaging technology are also increasing. With its high speed, large capacity, and low latency, 5G technology is driving a profound technological innovation in the packaging industry.
Heterogeneous and heterogeneous integration technology
The packaging requirements of 5G millimeter wave devices have given rise to the development of heterogeneous and heterogeneous integration technologies. This technology integrates active and passive devices of different materials and structures into a complete functional module through heterogeneous growth or heterogeneous bonding. This integrated solution gives full play to the advantages of various materials and effectively solves the packaging problem of 5G high-frequency devices.
System-in-Package (SiP)
System-in-package (SiP) technology achieves a high degree of integration by integrating multiple functional chips, such as processors and memories, in a single package module. SiP technology not only meets the needs of 5G for miniaturization and thinness, but also facilitates customer product design and manufacturing by simplifying the supply chain and reducing costs.
Encapsulation substrate material
5G packaging puts forward more stringent requirements for substrate materials, including low loss, high heat dissipation, and excellent electrical performance. Currently, low-loss laminates, low-temperature co-fired ceramics (LTCCs), and glass substrates are the mainstream substrate materials in 5G packages. These materials are widely used in the packaging of 5G devices according to different performance requirements and cost considerations.
Figure: Innovation and application of packaging technology in the 5G era
Interconnect technology
As packaging densities increase, traditional wire bonding technologies are no longer sufficient, and are replaced by advanced interconnect technologies such as flip-card, through-silicon via (TSV), and fan-out packages. TSV technology effectively reduces signal delay and improves signal transmission speed by realizing vertical electrical interconnection inside the chip, providing technical support for the miniaturization and high performance of 5G packaging.
The packaging of 5G mmWave devices requires integrated antennas to reduce losses and improve transmission efficiency. Antenna-on-package (AiP) technology integrates the antenna into the package, using 3D packaging technology to shorten the feeder length, reduce losses, and improve system efficiency. At present, AiP technology has been widely used in millimeter wave devices and has become an important direction for antenna packaging in the future.
The rapid development of 5G technology has brought new challenges and opportunities to the packaging industry. From heterogeneous integration technology to SiP, from substrate materials to interconnection technology, to antenna packaging solutions, packaging technology in the 5G era is developing in the direction of higher performance, higher integration, and lower power consumption. With the continuous progress and innovation of technology, packaging technology will play a more critical role in the field of 5G communication, bringing a richer and more efficient communication experience to human society.
