It is reported that Texas Instruments recently introduced six power modules designed to increase power density, increase efficiency, and reduce electromagnetic interference (EMI). Leveraging TI's proprietary MagPack integrated magnetic packaging technology, these power modules are 23% smaller than competing modules, enabling designers of industrial, enterprise, and communications applications to achieve previously impossible levels of performance.
Size is a critical factor in power supply design. Power modules simplify power supply design and save significant board space by integrating the power chip with a transformer or inductor in a single package. Through TI's unique 3D packaging molding process, MagPack packaging technology optimizes the size of the power module, resulting in increased power output in a smaller area.
TI's power modules using MagPack technology are 23% smaller in size compared to competing modules. This enables designers of industrial, enterprise, and communications applications to achieve previously impossible levels of performance.
In particular, three of these products (TPSM82866A, TPSM82866C, and TPSM82816) are known as the industry's smallest 6A power modules, providing industry-leading power density. In addition, these new devices achieve a higher power density of nearly 1A per 1 square millimeter area through highly integrated magnetic packaging technology. The magnetic packaging technology includes an integrated power inductor with a proprietary new design material that helps engineers achieve best-in-class power density.
Figure: Six power modules built with the new MagPack packaging technology (Source: Texas Instruments)
TI maximizes the height, width, and depth of power modules through its proprietary 3D package molding process to deliver more power in less space. This packaging technology includes an integrated power inductor that optimizes magnetic properties with new materials and designs.
In addition, these new modules are suitable for a wide range of applications in industrial, enterprise and communications applications, especially those where space, efficiency and EMI are critically designed. For example, in communication equipment, magnetic packaging technology is used to achieve miniaturization and high energy efficiency in the power supply segment. With the continuous development of communication technologies such as 5G and 6G, the requirements for miniaturization and lightweight are getting higher and higher, and magnetic packaging technology just meets this demand. Magnetic packaging technology has a wide range of application scenarios in many fields such as power modules, communication equipment, new energy vehicles, industrial automation, medical equipment, and data centers. With the continuous progress of technology and the continuous expansion of application fields, magnetic packaging technology will play an important role in more fields.
TI's innovative magnetic packaging technology enables significant reductions in power module size, significant improvements in power density, and enhanced efficiency and EMI control capabilities through its unique MagPack integrated magnetic packaging technology and 3D packaging molding process. These technical features make TI's new power modules significantly competitive in a variety of applications.
