According to media reports, TSMC has recently announced that it has cooperated with its Creative Electronics to obtain a large order for the key basic interface chips of the next generation HBM4 after the exclusive foundry of AI chips of technology giants such as Nvidia and AMD. On the other hand, SK hynix has announced that it is working with TSMC to sprint for HBM4 and advanced packaging business opportunities.
It is understood that the design order entrusted by SK hynix to GUC involves the crucial basic interface chip in HBM4. This chip is the core component of HBM4 technology, which is of great significance for improving the bandwidth transmission speed and meeting the higher performance requirements of the new generation of AI chips. According to the requirements of the order, TSMC's 12nm and 5nm process technologies will be used according to different needs for high efficiency or low power consumption, fully demonstrating TSMC's leading position and flexibility in advanced process technology.
The biggest change in HBM4 technology is that in addition to increasing the number of DRAM stack layers to 16 layers, it also requires the integration of logic ICs at the bottom of HBM to increase bandwidth transmission speeds. As a result of this change, HBM4 has significantly improved capacity and speed, which can better meet the current and future needs of high-performance computing, artificial intelligence, and other storage technologies. The basic interface chip that GUC is responsible for is the key to achieving this change.
Figure: TSMC and GUC won a large order for SK hynix chips
This cooperation is of far-reaching significance for both TSMC and GUC. For TSMC, this is not only an affirmation of its technical strength and market competitiveness, but also provides strong support for it to further consolidate its leading position in the field of high-end chip manufacturing. At the same time, through the cooperation with SK hynix, TSMC will have the opportunity to further expand its market share in HBM4 and advanced packaging technology, laying a solid foundation for the company's future growth.
For GUC, the order will make a significant contribution to its revenue in the second half of the year, and will also help the company further penetrate the HBM supply chain and strengthen its position in this field. Through the cooperation with SK hynix, GUC will have the opportunity to access more advanced technologies and market needs, providing more opportunities and challenges for its future development.
With the continuous development of AI technology, the demand for high-speed computing (HPC) chips and storage technologies such as HBM is growing simultaneously. SK hynix, Samsung, Micron and other three major memory chip manufacturers are actively investing in the research and development of the next-generation product HBM4, with the goal of mass production by the end of 2025 and mass shipment in 2026. This market trend provides a broad market space and development opportunities for the cooperation between TSMC and GUC.
