In the rapid development of artificial intelligence (AI) and high-performance computing (HPC) fields around the world, chip packaging technology is becoming increasingly important. As the world's leading semiconductor manufacturing company, TSMC is actively exploring and developing new chip packaging technologies to meet the growing demand for performance and integration, while coping with the rapid advancement of AI technology.
With the continuous development of AI technology, the requirements for chip performance, power consumption, and integration are also increasing. Traditional packaging technologies have been unable to meet these challenges, so TSMC has begun to look for more advanced packaging solutions. Through continuous research and innovation, TSMC has made significant progress, launching a series of industry-leading new packaging technologies.
Among them, TSMC has successfully developed a high-performance computing and artificial intelligence chip packaging platform using silicon photonics technology. This technology transmits data over optical fibers instead of I/O, greatly improving data transmission bandwidth and efficiency while reducing power consumption and latency. This silicon photonics integration technology provides an unprecedented performance boost for AI accelerators and high-performance computing systems, making it more efficient to process large-scale datasets and complex algorithms.
In addition, TSMC has also launched a 2.5/3D integrated technology called "3D Fabric". This technology consists of two parts, Front-end (FE 3D) and Back-end (BE 3D), which is designed to achieve higher chip integration and performance. FE 3D focuses on interconnecting technologies after stacking silicon dies, while BE 3D focuses on connecting multiple silicon chips together at high density and connecting them to the packaging substrate. With this technology, TSMC is able to superimpose multiple heterogeneous chip blocks on the substrate chip to maximize I/O performance. At the same time, an integrated voltage regulator is used to handle the power supply, further improving the stability and reliability of the system.
Figure: TSMC explores new AI chip packaging technology
The introduction of these new packaging technologies not only improves the performance of AI accelerators and high-performance computing systems, but also reduces power consumption and cost. By adding more high-bandwidth memory (HBM) and chiplet modules, TSMC's new packaging technology provides more computing resources and storage capacity for AI applications, making it faster and more efficient to handle complex tasks.
Looking ahead, as the AI and high-performance computing markets continue to expand, TSMC's new packaging technology is expected to play an even more important role. These technologies can not only be applied to AI accelerators and high-performance computing, but can also be expanded to more fields, such as data centers, cloud computing, autonomous driving, etc. Through continuous technological innovation and market expansion, TSMC will continue to lead the development of the semiconductor industry and provide strong technical support for the future intelligent era.
TSMC has injected new vitality into the development of AI and high-performance computing by exploring new chip packaging technologies. The introduction of these technologies not only improves the performance and integration of chips, but also reduces power consumption and cost, which is expected to drive the further development of the entire semiconductor industry. We look forward to TSMC continuing to bring more innovative technologies in the future and making greater contributions to scientific and technological progress and industrial development."
