Xindamao Microelectronics (hereinafter referred to as "Xindamao") was established in Xiamen Torch Park in 2018. It is a professional semiconductor chip and solution design company dedicated to the research, development, design and application of third-generation semiconductors. In recent years, the company has developed strongly. In 2019, it launched a strategic cooperation with Xiamen Tungsten Group. The first isolated gate driver IC was launched. In 2020, IGBT single tubes and modules were successfully mass-produced. In 2021, GaN MOSFET and SiC MOSFET devices were officially launched, and In 2022, it obtained the first round of equity financing from state-owned funds.
Xindamao's current main customers include: Xiamen Tungsten Industry, Diodes (American and Taiwan Semiconductor), Google, CoolerMaster, Skyworth, Changhong, Kehua Technology, Hualian Electronics, Aveda, AVIC Tech, Protech, etc.; main cooperation Agents include: Green Sky Technology Co., Ltd., Heshuo, Fulian Industrial, Infinel, Hangyu Tongda, etc.
The company's target market end customers are distributed in industrial application fields such as frequency converters, electric welding machines, photovoltaic inverters, uninterruptible power supplies, water pumps, fans, charging piles, and automotive master control. Before the brand is established and there are a lot of achievements at the beginning, the company plans to rely on the development of brushless motor control solutions for new energy vehicle motors, water pumps, fans, ceiling fans, etc. within the Xiamen Tungsten system, and cooperate closely with various project companies as early as possible to assist them in product development and establish corporate brands and reputation. Secondly, with the help of the relationship resources between Xiamen Tungsten and the fund, it will enter the supply chain of benchmark companies with a certain reputation in the industry, thereby affecting the use of large and medium-sized enterprises in the corresponding industry and increasing the market share.
Make full use of the company's internal controller solution provider's functions, introduce the company's component products (IGBT single tubes, modules, driver ICs) into the customer solution development and design, and directly enter the market. And through agents, we provide the company's corresponding product and service support with existing projects to expand sales performance. In terms of sales model, IGBT single tubes, modules and driver ICs adopt direct sales and agency methods in parallel: the direct sales part is responsible for the regional business in Fujian, South China, East China, and Central China; the agency part is managed by the regions of South China, East China, and Central China. IGBT chips only use direct sales.
At present, the company as a whole is in a stage of steady development. With the support of a high-quality R&D team, the product has achieved breakthrough results in recent years. After three years of industrial R&D, mass production improvement, and market verification, 36 patents have been filed. Products include isolated gate driver ICs, IGBT single transistors, modules, GaN/SiC JBS, MOS devices, etc. The production capacity and quality stability of the products are also gradually increasing.
After the product has achieved certain results, the company actively seeks strategic investment partners, introduces supply chain and customer resources, expands market layout, and increases product awareness. In 2022, the Xindamo series of products were successively unveiled at domestic and international conferences such as the "2022 China Motor Intelligent Manufacturing and Innovation Application and Motor Industry Chain Exchange Conference", "2022 Asia-Pacific International Power Products and Technology Exhibition", and "Xiamen Semiconductor and Integrated Circuit Application Exhibition". The IGBT series of products provide a motor "heart" with advantages such as high performance and high reliability, which strongly promotes the development of new energy, industry, transportation, and intelligent manufacturing.
In 2022, Xindamao has completed its first round of equity financing, and Chuanghe Xincai (Xiamen) Manufacturing Transformation and Upgrading Fund Partnership (Limited Partnership) ("Chuanghe Xincai") has become the company's second largest shareholder. This round of capital injection has gathered national funds, local government guidance funds and well-known listed companies to jointly help Xindamao open a new chapter of leapfrog innovation and development.
It is reported that Xindamao will continue to focus on the new energy market in the future, with photovoltaics and new energy vehicles as the main development directions. On the basis of continuing to improve the 650V/1200V IGBT product line, it will complete the mass production of 1700V products and complete the batch production of 1200V SiC MOSFET products. Put it on the market, promote the 1700 SiC MOSFET product line planning, develop multi-channel isolation driver ICs that comply with automotive regulations (AEC-Q101), and continue to promote the market layout of GaN products to achieve mass production in 2023.
At present, the company's products cover a wide range of power device product lines. First of all, it has its own products IGBT\SiC-SBD, SiC-Mos,\SJ-MOS\SGT-MOS with complete types and specifications. Secondly, it has resistors\electrolytics\capacitors\diodes\ Transistors\VD-MOS\, etc. all have related supporting supply chains to meet the full range of customer needs.
Currently, Xindamao mainly promotes three products:
IGBT series
650V IGBT single-tube products, 1200V IGBT single-tube products, power integrated modules (PIM), intelligent power modules (IPM)
Using trench structure + field cutoff technology (Trench+FS). The special design of the wafer cell area and terminal field plate enables IGBT to have high reliability and excellent electrical parameter consistency. Suitable for industrial frequency converters, servo motors, UPS power supplies, inverters and other fields.
SiC series
SiC MOSFET
Excellent gate oxide layer reliability; extremely low switching losses and conduction losses; driver compatible with silicon-based MOSFETs and IGBTs (+18V); sufficient short-circuit avalanche resistance. Used in vehicle OBC, inverter, charging module, rail transit, new energy power generation, motor drive, energy storage system and other fields.
Gate driver IC
XN2811
An optocoupler-compatible single-channel isolated gate driver that has better common-mode transient immunity, longer service life (better reliability), wider temperature range, and propagation delay parameters than traditional optocouplers. The consistency between chips is higher and the cost is more advantageous. Moreover, pin2pin is compatible with the mainstream gate drive optocoupler series products on the market. The packaging and current drive are consistent with them. It is currently the best product to replace the photoelectric isolation gate driver. Used in motor drives, high-voltage DC-DC converters UPS, inverters, electric vehicles (EV), hybrid electric vehicles (HEV), solar inverters and other fields.
At present, the shipment volume, delivery time, unit price and minimum order quantity of the company's three main IGBT products are as follows:
IGBT 650V/75A single tube
XD075H065CX1S3
Delivery time: 1 week if wafers are in stock, 4-6 weeks if wafers are not available, 16-18 weeks if wafers are not available
Unit price: 11 yuan
Shipment volume: 300K/month
Minimum order quantity: 1K
IGBT 1200V/15A module
XP015PJE120 AT1B1
Delivery time: 1 week if wafers are in stock, 4-6 weeks if wafers are not available, 16-18 weeks if wafers are not available
Unit price; 65 yuan/pcs
Shipment volume: 50K/month
Minimum packaging: 32pcs
IGBT 1200V/25A module
XP025PJE120 AT1B2
Delivery time: 1 week for spot wafers, 4-6 weeks for wafers, 16-18 weeks for unavailable wafers
Unit price 93 yuan/pcs
Shipment volume: 50K/month
Minimum packing: 20pcs
In addition, the company's Changhong development is also inseparable from the support of the technical team. The following is an introduction by the main person in charge of the technical team:
Mr. Cai (CTO): Ph.D. from MIT, internationally renowned semiconductor expert, Xiamen Taiwan Distinguished Expert, and one of Taiwan’s top ten outstanding engineers; former senior technical director of the Taiwan Industrial Research Institute. He has been deeply involved in the semiconductor industry for more than 30 years and has experience in China, the United States and Taiwan. There are more than 40 patents in other countries/regions.
Mr. Xu (Vice President of R&D): Master of Taiwan National Chiao Tung University; former senior technical director of TSMC. He has accumulated nearly 30 years of rich experience in power device R&D and holds more than 60 patents.
Mr. Li (Vice President of R&D) holds a master's degree from National Tsing Hua University in Taiwan; he is a former senior technical director of a well-known semiconductor company in Taiwan. He has been engaged in the research and development of integrated circuit systems for more than 20 years and holds more than ten patents.
In the future, Xindamao will continue to benchmark against first-class international brands, with high-end semiconductor power devices and third-generation semiconductor products as its main direction, with the realization of domestic substitution as its corporate mission, and by adhering to the customer-centered concept, hoping to further follow the domestic trend. The system application companies cooperate deeply to break the foreign monopoly and form the real combat power of domestic system manufacturers!
