According to the official website of FOXCONN, FOXCONN and YAGEO announced a strategic semiconductor collaboration. The jointly-owned XSEMI will transfer its IC and SiC component/module business to a new IC design subsidiary established by the FOXCONN for a total of NTD 204 million (approximately RMB 47.12 million).
At the same time, in order to further strengthen the cooperative relationship, the two companies will also adjust the ownership structure of XSEMI. YAGEO will hold 55% of XSEMI, while FOXCONN will hold the remaining 45%. In addition, Chen Taiming, chairman of YAGEO, will be the chairman of XSEMI. As a result, FOXCONN will focus on automotive IC and solutions, while YAGEO will focus on developing MOSFET products.
According to the data, XSEMI is an IC design company jointly established by FOXCONN and YAGEO in 2021, which mainly designs, develops and produces power management and power components/modules related products for automotive, communication and industrial control applications. With the strategic support and resource blessing of the two major shareholders, team of XSEMI building and product development have been rapidly developed.
In the second year of establishment of XSEMI, the self-developed power IC and MOSFET were mass-produced and shipped to PC system manufacturers and industrial control/consumer electronics customers. The 1200V/800A SiC silicon carbide power module was unveiled on FOXCONN Technology Day in the fourth quarter of last year. IC products/reference design, SiC, etc. have intensively entered the design-in stage of car factory/supply chain customer design introduction, especially in Powertrain.
FOXCONN and YAGEO Group pointed out that after this strategic adjustment, XSEMI's division of labor and cooperation in the field of small IC will be clearer in the future. FOXCONN will focus on automotive IC and solutions, while YAGEO will focus on MOSFET product development by combining APEC, and expand the layout of active components. Both parties will guide each other's most favorable resources to the field of maximizing benefits.
It is reported that after integrating the IC and SiC component/module product lines and teams of XSEMI Semiconductor, FOXCONN's newly established IC design subsidiary will cooperate with FOXCONN Electric Vehicle's planning to start passenger car delivery at the end of this year, and work more closely with relevant business groups within FOXCONN Group to develop new electronic motor architecture (EEA) software and hardware integrated automotive subsystem IC and solutions. At the same time, it will jointly develop a new generation and new architecture competitive automotive solutions with upstream and downstream manufacturers of various vehicle subsystems and supply them to global automakers and automotive supply chain manufacturers.
Source: ESM-China
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