HISILICON WiFi chip Hi3861V100

Hi3861V100 is a highly integrated 2.4GHz SoC WiFi chip that integrates IEEE 802.11b/g/n baseband and RF circuits. The RF circuits include power amplifier PA, low noise amplifier LNA, RF balun, antenna switch and power management modules; support 20MHz standard bandwidth and 5MHz/10MHz narrow bandwidth provide a maximum physical layer rate of 72.2Mbit/s. Hi3861V100 WiFi baseband supports Orthogonal Frequency Division Multiplexing (OFDM) technology, is backward compatible with Direct Sequence Spread Spectrum (DSSS) and Complementary Code Keying (CCK) technology, and supports various data rates of the IEEE 802.11 b/g/n protocol. . Hi3861V100 chip integrates a high-performance 32-bit microprocessor, hardware security engine and rich peripheral interfaces. The peripheral interfaces include SPI, UART, I2C, PWM, GPIO and multi-channel ADC. It also supports high-speed SDIO2.0 Slave interface, and the highest clock can Up to 50MHz; the chip has built-in SRAM and Flash, can run independently, and supports running programs on Flash.

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Product Introduction&Application Fields

product details

1. Powerful radio frequency performance and anti-interference ability

2.Multiple security capabilities and mesh networking capabilities

3.Pre-connect to multiple ecosystems and one-touch/proximity distribution network capabilities (HarmonyOS/HIlink feature)

4.General specifications

1x1 2.4GHz frequency band (ch1～ch14)
PHY supports IEEE 802.11b/g/n MAC supports IEEE802.11 d/e/h/i/k/v/w
Built-in PA and LNA, integrated TX/RX Switch, Balun, etc.
Supports STA and AP forms. When used as an AP, it supports up to 6 STAs.
Support WFA WPA/WPA2 personal, WPS2.0
Supports 2/3/4-wire PTA solutions that coexist with BT/BLE chips
Power supply voltage input range: 2.3V～3.6V IO power supply voltage supports 1.8V and 3.3V
Support RF self-calibration solution
Low power consumption tested under the conditions of ambient temperature 25℃: Ultra Deep Sleep mode: 3μA@3.3V Tested under the conditions of ambient temperature 25℃, receiving RX time length 1ms, chip BUCK power supply, shielded environment:

DTIM1：1.27mA@3.6V

DTIM3：0.523mA@3.6V

DTIM10：0.233mA@3.6V

5.PHY characteristics

Supports all data rates of IEEE802.11b/g/n single antenna
Supported maximum rate: 72.2Mbps@HT20 MCS7
Supports standard 20MHz bandwidth and 5M/10M narrow bandwidth
Support STBC
Support Short-GI

6.MAC features

Support A-MPDU, A-MSDU
Support Blk-ACK
Support QoS to meet different business service quality requirements

7.CPU subsystem

High-performance 32bit microprocessor, maximum operating frequency 160MHz
Embedded SRAM 352KB, ROM 288KB
Embedded 2MB Flash

8.Peripheral interface

1 SDIO interface, 2 SPI interfaces, 2 I2C interfaces, 3 UART interfaces, 15 GPIO interfaces, 7 ADC inputs, 6 PWM, 1 I2S interface (Note: The above interfaces are implemented through multiplexing)
External main crystal frequency 40M or 24M

Product specifications

Registration

HISILICON