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BIWIN

BIWIN eMCP embedde storage

eMCP is a product based on MCP (Multi-Chip Packaging; multi-chip packaging technology). It uses an eMMC chip plus a low-power DRAM solution, which effectively simplifies the manufacturing process and development costs of customer products and shortens the development time of end products. Speed ​​up the launch of end products.

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Merchant qualification:

Shenzhen BiWin Storage Technology Co., Ltd. was established in Shenzhen, China, in 1995. Over the past 19 years, the company has been dedicated to the application and research of NAND FLASH products. Its product range includes SSD solid-state drives, embedded storage chips, and wireless charging modules. BiWin Storage is a domestic enterprise that has introduced its own brand of embedded storage chips. The investment in production equipment has reached 300 million RMB, and in 2009, a 12-inch wafer packaging and testing factory was established, making it one of the few privately-owned enterprises in South China with this technology.

Product Introduction&Application Fields

product details

  • Interface: eMMC+LPDDR4X

  • Size: 5x13x1.0mm/11.5x13x1.2mm

  • Maximum sequential read speed: 320MB/s

  • Maximum sequential write speed: 260MB/s

  • Working temperature: -20℃~85℃

Product specifications

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