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BIWIN

BIWIN ePOP embedded storage

ePOP combines MMC and Mobile LPDDR in a single package with different capacities. These products are widely used in mobile applications. With leading wafer packaging technology, including wafer grinding, lamination and wire bonding technology, BIWIN integrates RAM and ROM in one device, which not only improves performance and is more energy-saving, but also saves printed circuit board space (PCB) has shorter development time for customers. ePOP products have excellent features such as small size, low power consumption, low cost, and simple development. They are ideal solutions for portable and handheld devices, such as smartphones, tablets, PMPs, PDAs, and other media devices.

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Merchant qualification:

Shenzhen BiWin Storage Technology Co., Ltd. was established in Shenzhen, China, in 1995. Over the past 19 years, the company has been dedicated to the application and research of NAND FLASH products. Its product range includes SSD solid-state drives, embedded storage chips, and wireless charging modules. BiWin Storage is a domestic enterprise that has introduced its own brand of embedded storage chips. The investment in production equipment has reached 300 million RMB, and in 2009, a 12-inch wafer packaging and testing factory was established, making it one of the few privately-owned enterprises in South China with this technology.

Product Introduction&Application Fields

product details

  • Interface: eMMC: eMMC 5.0/eMMC 5.1; LPDDR 2/3 (32bit), LPDDR 4/4X (16bit)

  • Dimensions: 10mm × 10mm × 0.9mm

  • Maximum sequential read speed: 260MB/sec (Max.)

  • Maximum sequential write speed: 320MB/sec (Max.)

  • Working temperature: -20℃~85℃

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