Gowin

Guangdong Gowin Semiconductor Technology Co., Ltd. was established in 2014. It is a domestic FPGA high-tech company specializing in the R&D and design of field programmable logic devices (FPGA). It is committed to providing customers with chips, EDA development software, IP, and One-stop service from boards to overall system solutions. After years of accumulation, GOWIN Semiconductor has core independent knowledge in the entire ecological chain such as FPGA chip architecture, SOC chip design, FPGA integrated EDA development environment, and FPGA general solutions, as well as domestic and foreign invention patents. Through the latest process selection and design optimization, GOWIN Semiconductor has achieved high-quality, high-reliability FPGA products that are comparable to similar products of international giants in the existing market, and have been used in automobiles, industrial control, electric power, communications, medical, data centers, etc. Achieve large-scale mass production in application fields. Currently, the company has more than 200 employees and has R&D centers in Guangzhou, Shanghai, and Jinan. With the rapid development of the company's business in domestic and foreign markets, the company's scale has been continuously expanding.

The core backbone of the company has more than 15 years of practical experience in internationally renowned FPGA companies. They have experienced several generations of FPGA chip hardware, EDA software, IP research and development, marketing, sales, and technical support at home and abroad. They are a pragmatic team with rich experience and the ability to continuously innovate. team. In the first quarter of 2015, the company mass-produced China's first industrialized 55nm process 4 million-gate medium-density FPGA chip, and opened EDA development software for download; in the first quarter of 2016, the company successfully launched the country's first 55nm embedded Flash SRAM. non-volatile FPGA chips; in 2017, large-scale shipments of FPGA chips were achieved; in 2019, the first domestic FPGA automotive-grade chip was released and large-scale mass production was achieved. Based on the local market and laying out the global market, as of 2021, Gowin Semiconductor has achieved large-scale mass production of more than 100 FPGAs and special-purpose chips in three major series: Little Bee (GW1N), Chenxi (GW2A), and ASSP GoBridge in many regions around the world.